A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.

An electronic card comprising: a first card portion including lightning protection components, a first ground plane and a first ground zone; a second card portion comprising functional components, a second ground plane and a second ground zone; a third card portion, which separates and electrically isolates the first ground plane and the first ground zone from the second ground plane and from the second ground zone; the first ground zone and the second ground zone being unvarnished; the first ground zone and the second ground zone being arranged in order to be applied onto a housing element that is electrically conductive and that belongs to a housing in which the electronic card is integrated.

ESD suppressor and manufacturing method thereof. The ESD suppressor include at least two printed circuit boards, one insulating frame, two terminal electrodes and two or more interior electrodes. The insulating frame is positioned between the two printed circuit boards, so as to form a main structure with a cavity. For each printed circuit board, at least one interior electrode is positioned on the surface facing the cavity and separated from other interior electrode(s). Two terminal electrodes are positioned on two different surfaces of the main structure and electrically connected to different interior electrodes respectively. Optionally, the insulating frame is a hallowed out printed circuit board or a frame formed by printing insulating material. In the manufacturing method, the thickness of the insulating frame is adjusted to adjust the relative distance between different printed circuit boards, so as to further adjust the breakdown voltage of the ESD suppressor

Various embodiments relate to an electronic device including a foldable conducive plate. The electronic device may include: a foldable housing at least partially foldable via a hinge; a display including a flexible display panel viewable through a front surface of the foldable housing and being at least partially foldable, and a conductive plate disposed on a rear surface of the flexible display panel and supporting the flexible display panel; a circuit board disposed to face at least a portion of a border of the conductive plate in the foldable housing; and at least one conductive connection member comprising a conductor disposed between the conductive plate and the circuit board and electrically connecting the conductive plate and a ground of the circuit board.

Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supported by the housing and include a conductive pathway extending around at least part of a perimeter of a first side of the circuit board. The conductive pathway can be electrically coupled to an electrical ground for the circuit board. The one or more controllers can be mounted on the circuit board and activate and deactivate the negative pressure source.

A display device including: a display module including a display panel for displaying an image and a circuit board connected to the display panel; a support plate disposed on a surface of the display module; and a conductive adhesive film disposed between the circuit board and the support plate, the conductive adhesive film including: a double-sided adhesive film fixed to a surface of the support plate and a surface of the circuit board; and a single-sided adhesive film fixed to one of the surface of the support plate and the surface of the circuit board.

A display device includes a display panel including a plurality of pixels, a first panel pad, and a second panel pad and a circuit board including a first substrate pad and a second substrate pad to apply a first power voltage to the first panel pad and the second panel. The display panel further includes a first power line pattern connected to the second substrate pad to apply the first power voltage to the pixels and a second power line pattern connected to the first substrate pad. The circuit board includes a first electrostatic discharge protection circuit connected between the first substrate pad and the second substrate pad, a substrate power pattern electrically connected to the first substrate pad, a ground pattern receiving a ground voltage, and a second electrostatic discharge protection circuit connected between the substrate power pattern and the ground pattern.

Systems and methods are provided for cover plates for printheads. One embodiment is an apparatus that includes a cover plate for a printhead. The cover plate includes multiple layers of electrically conductive material, a layer of nonconductive ferrite that is sandwiched between the multiple layers, and at least one connector that penetrates through the multiple layers and the layer of nonconductive ferrite to form a conductive pathway for electric current between the multiple layers through the layer of nonconductive ferrite. The cover plate also includes at least one opening that penetrates through the multiple layers and the layer of nonconductive ferrite, and that is configured to align with nozzles of the printhead.

A detonator module provides for the use of a wide range of different addressable switches for use in perforating guns. The detonator module permits pre-assembly of a desired addressable switch and conforms the electrical connectivity to a particular perforating gun. In this manner, nearly any addressable switch can be used from any manufacturer despite having different sizes or wiring layouts. The pre-assembled detonator module can be safely shipped due to a safety shunt that can be removed on site prior to installation into a perforating gun. In one sense, the detonator module permits conformance of multiple different types of addressable switches to a particular type or model of perforating gun, permitting flexible choice of addressable switch for a particular project.

The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.