Patent classifications
H05K1/0259
Apparatus with charge dissipation
An electrical apparatus has an external conductive housing. A printed circuit board is provided (separate to a main circuit board of the apparatus) within a PCB housing. The printed circuit board is mechanically and electrically connected to the external housing and has an arc gap between a first contact which connects electrically to the external housing and a second contact which connects electrically to a power supply terminal. Thus, a dedicated circuit is used to perform a discharge function so that the housing and main circuit board do not need to be redesigned.
PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING THE SAME
A printed circuit board and an electronic apparatus having the printed circuit board are provided. The printed circuit board includes a circuit board body and an electronic element disposed on the circuit board body, the circuit board body is provided with a conductive hole, the circuit board body is grounded by a conductor provided in the conductive hole, and at least one through hole is disposed between the conductive hole and at least part of the electronic element.
COMPOSITE ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, BOARD FOR MOUNTING THEREOF, AND PACKAGING UNIT THEREOF
A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.
RESIN SUBSTRATE AND ELECTRONIC DEVICE
A resin substrate includes an insulating base material in which conductive particles are mixed with resin, and conductor patterns provided on the principal surfaces of the insulating base material. When a length at a position at which a distance between two conductor patterns that are adjacent to each other without directly electrically connecting to each other on the same principal surface of the insulating base material is smallest is indicated by L1 and a length at a position at which a distance between two conductor patterns that face each other without directly electrically connecting to each other between the different principal surfaces of insulating base materials is smallest is indicated by L2, L1 is larger than or equal to L2 (L1 L2).
Flexible printed circuit board, method for manufacturing the same, and capacitive touch display device
The present disclosure provides a flexible printed circuit board (FPCB), a method for manufacturing the FPCB, and a capacitive touch display device with the FPCB. The FPCB comprises an FPCB substrate and a common electrode voltage (VCOM) filter circuit arranged on the FPCB substrate. The FPCB further includes one or more filter units. the filter units comprises: a conduction layer, arranged on the FPCB substrate and electrically connected to a VCOM output end of the VCOM filter circuit; an isolation layer, arranged on the conduction layer; and a shielding film, which is grounded, arranged on the isolation layer and arranged parallel with the conduction layer.
Electronic device and board usable in the electronic device
An electronic device includes an exterior portion of a conductive material, a circuit portion including circuit elements, and a protection circuit portion connected between the exterior portion and the circuit portion. The protection circuit portion includes a switching unit to intercept leakage current that flows from the circuit portion and leaks to the exterior portion, and a conversion unit to reduce a voltage level of an electrostatic component that flows through the exterior portion and to transfer the electrostatic component to the switching unit.
ELECTROSTATIC DISCHARGE PROTECTION FOR ANTENNA USING VIAS
An integrated circuit device is formed to include a plurality of vias that connect an antenna to a ground reference. This configuration of the integrated circuit device provides an electrical path from the antenna to ground, thereby preventing the buildup of charge at the antenna. The vias thereby reduce the likelihood of a potential difference between components of the integrated circuit device and the antenna, in turn reducing the likelihood of electrostatic discharge at the integrated circuit device.
MULTI-CHANNEL TRANSIENT VOLTAGE SUPPRESSOR
A multi-channel transient voltage suppressor includes a plurality of diode strings, a Zener diode and a diode array. The diode strings respectively have a plurality of input output terminals. The diode array includes a first bypass diode and a second bypass diode. The first bypass diode is coupled between a common bus and a ground terminal, and provides a forward turned-on path from the ground terminal to the common bus. The second bypass diode is coupled to the first bypass diode in parallel, and provides a reverse turned-on path from the common bus to the ground terminal. A current dissipation path is formed between each of the input output terminals and the ground terminal by the diode array.
ELECTRONIC UNIT COMPRISING AN ESD PROTECTIVE ARRANGEMENT
The disclosure relates to an electronic unit with a circuit board having at least one component arranged on a main surface of the circuit board and a casing element, which incorporates the at least one component, as well as with an ESD protection arrangement for the circuit board. According to the disclosure, open areas on the circuit board, which are not covered by the casing element, are covered with a gold layer directly mounted on a copper surface of the circuit board.
Wiring substrate and display panel
A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.