The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

A leadwire for physiological patient monitoring is provided that transfers potentials received at a chest electrode to a data acquisition device. The leadwire includes an electrode end connectable to the chest electrode and a first conductive layer extending from the electrode end. The leadwire also has a device end connectable to a data acquisition device and a second conductive layer extending from the device end. The first conductive layer is galvanically isolated from the second conductive layer such that the first conductive layer and the second conductive layer form a capacitor.

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

A film for an electronic board, according to one embodiment, has a low dielectric constant of 2.9 or lower at a frequency of 10-40 GHz, and thus can cause the signal transmission rate for a high frequency use, such as fifth generation (5G) mobile communication, to be superior to that of a conventional film for an electronic board. In addition, the film for an electronic board has flexibility and physicochemical characteristics that are greater than or equal to those of a conventional film, so as to be applicable to the manufacture of a laminate of a conductive film such as FCCL and an electronic board such as a FPCB, thereby enabling processability, durability, transmission capacity and the like to be improved.

A polyphenylene ether resin modified with two amino functional groups, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the two amino functional groups has a structural formula as follows:

##STR00001## in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a Kurtosis (Rku) of the first surface ranges from 3.0 to 60.0. With the Rku, the LCP film is able to improve the peel strength with a metal foil and ensure that a laminate comprising the same maintains the merit of low insertion loss.

An object of the present invention is to provide a liquid crystal polymer film having an excellent peel strength of a laminate produced by sticking a metal foil to the liquid crystal polymer film; and a laminate.

A liquid crystal polymer film including a liquid crystal polymer, in which in a case where a cross-section of the liquid crystal polymer film along a thickness direction of the liquid crystal polymer film is exposed and immersed in monomethylamine, and then void regions are extracted from an observed image of a cross-section obtained by using an electron microscope, an average value of widths of the void regions is 0.01 to 0.1 μm and an area ratio of the void regions in the observed image of the cross-section is 20% or less.

Provided is copper foil with a resin layer, the resin layer having excellent adhesion, the copper foil exhibiting low dielectric characteristics, which is suitable for high-frequency applications, the copper foil being capable of exhibiting excellent characteristics of reducing transmission loss. More specifically, a laminate of copper foil and an epoxy resin composition layer is provided, the epoxy resin composition layer being present on at least one surface of the foil, the epoxy resin composition containing an epoxy resin and an acid-modified polyolefin, wherein a test piece composed of the laminate and a prepreg has 90-degree peel strength between the copper foil and the prepreg of 0.6 N/mm or more as measured in accordance with JISC6481, and has a reduction rate of the 90-degree peel strength between the copper foil and the prepreg of 20% or less after immersion of the test piece in boiling water for 2 hours.

A metal-clad laminate includes: an insulating layer; and a metal foil being in contact with at least one surface of the insulating layer. The insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 specific groups per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer. The metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer. The contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness.