A number of user interface devices are described. In one example, a user interface device includes a lens having a graphic visible through the lens, a transparent circuit film comprising a top surface and a bottom surface, a reflector film bonded to the bottom surface of the transparent circuit film, the reflector film including an embossed area which defines a pocket between the reflector film and the bottom surface of the transparent circuit film, a light emitting diode (LED) bonded to the bottom surface of the transparent circuit film and positioned within the pocket between the reflector film and the bottom surface of the transparent circuit film, and a layer of transparent pressure-sensitive adhesive interposed between the bottom surface of the lens and the top surface of the transparent circuit film.

A thermoplastic composition includes: (a) poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) at least 10 wt % of a reinforcing filler comprising glass fiber; (c) a laser direct structuring (LDS) additive comprising a tin oxide, an antimony oxide, or a combination thereof; and (d) a reflection additive comprising a titanium compound. A weight ratio of total titanium in the composition to the LDS additive in the composition is at least 0.7:1, or a weight ratio of total titanium in the composition to the PCT is 1.1:1 or less.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

A composition comprising a monomer of the general formula (M1) wherein M is a metal or semimetal of main group 3 or 4 of the periodic table; X.sup.M1, X.sup.M2 are each O; R.sup.M1, R.sup.M2 are the same or different and are each an —CR.sup.aR.sup.b—Ar—O—R.sup.c; Ar is a C.sub.6 to C.sub.30 carbocyclic ring system; R.sup.a, R.sup.b are the same or different and are each H or C.sub.1 to C.sub.6 alkyl; R.sup.c is C.sub.1-C.sub.22-alkyl, benzyl or phenyl; q according to the valency and charge of M is 0 or 1; X.sup.M3, X.sup.M4 are the same or different and are each O, C.sub.6 to C.sub.10 aryl, or —CH.sub.2—; R.sup.M3, R.sup.M4 are the same or different and are each R.sup.M1, H, C.sub.1-C.sub.22 alkyl, or a polymer selected from a polyalkylene, a polysiloxane, or a polyether.

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The compound (A) is represented by formula (1).

R.sub.1O—R.sub.2—OR.sub.1   (1)

(In formula (1), each R.sub.1 independently represents a group represented by formula (2), or a hydrogen atom, and R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one R.sub.1 is a group represented by formula (2).)

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(In formula (2), -* represents a bonding hand.)

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.

An object of the present invention is to provide a polymer film, in which in a case where a laminate is manufactured by sticking a metal foil to the polymer film, the adhesiveness between the polymer film and the metal foil is excellent, and the performance of suppressing a misregistration of a wiring line formed on the metal foil is excellent even in a case of further laminating a sticking material on the wiring line; and a laminate.

A polymer film including a liquid crystal polymer, in which in a case where an elastic modulus at a position A at a distance of half of a thickness of the polymer film from one surface toward the other surface of the polymer film is defined as an elastic modulus A and an elastic modulus at a position B at a distance of ⅛ of the thickness of the polymer film from one surface toward the other surface of the polymer film is defined as an elastic modulus B in a cross-section along a thickness direction of the polymer film, a ratio B/A of the elastic modulus B to the elastic modulus A is 0.99 or less and the elastic modulus A is 4.0 GPa or more.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

Provided is a resin composition having high thermal resistance and low dielectric properties, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a cyanate ester compound (B) containing two or more aromatic moieties per molecule, the aromatic moieties being replaced by at least one cyanato group: where in Formula (M1), A is a four- to six-membered alicyclic group:

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