A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer. The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector, where an outer conductive layer is surface treated, is characterized by the steps of providing a hard gold-plated edge connector on a group of an insulating layer and a conductive layer, covering the conductive layer and the hard gold-plated edge connector with at least one group of an insulating layer and a conductive layer, surface-treating an outer conductive layer to form connector pads for wire bonding of electronic components, cutting the insulating layers and the conductive layers down to the conductive layer forming the hard gold-plated edge connector, removing the insulating layers and conductive layers from the hard gold-plated edge connector. The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the printed circuit board, and the inner conductive layer forming the hard gold-plated edge connector protruding from the plurality of insulating layers and conductive layers.

The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly.

A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly.

A fluorine-containing polymer for a metal-clad laminated sheet, containing: a polymerized unit based on a fluorine-containing vinyl monomer; and a polymerized unit based on a vinyl ester monomer other than the fluorine-containing vinyl monomer. The fluorine-containing polymer contains not more than 1 mol % in total of a polymerized unit based on a monomer containing a hydroxy group and a polymerized unit based on a monomer containing a carboxy group, of all polymerized units. Also disclosed is a composition containing the fluorine-containing polymer, a curable composition containing the fluorine-containing polymer and an epoxy resin, a metal-clad laminated sheet including a metal foil and a resin layer provided on the metal foil and being formed of the curable composition, and a printed substrate including a patterned circuit formed by etching the metal foil of the metal-clad laminated sheet.

A display substrate having a transparent electrode and manufacturing method thereof includes a transparent substrate, and a patterned channel is disposed on the transparent substrate; a transparent electrode including a composite material of MXene material and polyvinylpyrrolidone, and the transparent electrode is filled in the patterned channel. The transparent electrode of embodiments of the present disclosure has advantages of high transmittance, high conductivity, great machinability, great substrate affinity, great ductility, etc.

A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.