To provide a substrate with low dielectric loss tangent, relative permittivity, transmission loss and thermal expansion coefficient and excellent in mechanical strength, and a metal laminated substrate using this substrate.

A substrate comprising a tetrafluoroethylene polymer and an inorganic filler, wherein the rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm-thick specimen cut out from the substrate is at most 30%.

The present invention is directed to flexible conductive articles (600) that include a printed circuit (650) and a stretchable or non-stretchable substrate (610). In some embodiments, the substrate has a printed circuit on both sides. The printed circuit contains N therein a porous synthetic polymer membrane (660) and an electrically conductive trace (670) as well as a non-conducive region (640). The electrically conductive trace is imbibed or otherwise incorporated into the porous synthetic polymer membrane. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable or non-stretchable substrate by adhesive dots (620). The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.

A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

Compounds including two or more aromatic rings to which a fluorine-substituted arylcarbonyloxy group is directly bonded are useful as epoxy resin curing agents.

A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

A display substrate having a transparent electrode and manufacturing method thereof includes a transparent substrate, and a patterned channel is disposed on the transparent substrate; a transparent electrode including a composite material of MXene material and polyvinylpyrrolidone, and the transparent electrode is filled in the patterned channel. The transparent electrode of embodiments of the present disclosure has advantages of high transmittance, high conductivity, great machinability, great substrate affinity, great ductility, etc.

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10.sup.6 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

Provided is a fluorine resin surface modification method wherein an object to be processed and a processing device and the like are not readily damaged, wherefrom the risk of harmfully impacting a human body is small, and which can be carried out with simple equipment. The fluorine resin surface modification method including the steps of: irradiating an organic compound containing an oxygen atom with ultraviolet light having at least an intensity in a wavelength range of 205 nm or less to generate a radical; and bringing the radical into contact with a surface of a fluorine resin to form a hydrophilized layer on the surface.

A substrate with a conductive layer including a substrate, which is a woven or nonwoven fabric containing polytetrafluoroethylene (PTFE) nanofibers; and a conductive layer formed on the substrate, the conductive layer being formed from a conductive composition with a viscosity in a range of 1 to 500 Pa.Math.s measured at 25° C. with a rotational viscometer at a rotational speed of 50 rpm, wherein the following requirement (1) is satisfied: requirement (1); the substrate with a conductive layer has a Gurley permeability of 10 s/100 ml or less.

A flexible circuit board and a display panel are provided. The flexible circuit board includes a circuit board substrate layer, devices, a fluorinated-liquid solidification layer, and an insulating film. The devices are disposed on the circuit board substrate layer. Surfaces of the devices away from the circuit board substrate layer are covered with fluorinated liquid. The insulating film includes an insulating film substrate layer and a fluorine-containing adhesive layer. The fluorine-containing adhesive layer includes a resin adhesive and a fluorine-containing substance, and is in contact with the fluorinated liquid.