Various implementations disclosed herein include arrangements that reduce parasitic inductance associated with a discrete decoupling capacitor by using a three-terminal capacitor and a staggered array of power supply and ground connections. In some implementations, a capacitive decoupling arrangement includes a substrate, an array of electrical vias of first and second types, and a capacitive arrangement on one side of the substrate coupled to the array of electrical vias. The array of electrical vias includes a first type of vias and a second type of vias. The capacitive arrangement is coupled between two respective vias of the first type of vias and two respective vias of the second type of vias on the first planar surface of the substrate. The capacitive arrangement includes a plurality of capacitive elements electrically arranged in parallel between the two respective vias of the first type of vias and the two respective vias of the second type of vias.

An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.

Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

A hold down member can be surface mounted to a substrate, such that a post of the hold down member extends at least into an interposer. Accordingly, when an on board transceiver is placed in electrical communication with the interposer, a fastener can be inserted at least into the on board transceiver so as to attach to the post, thereby securing the on board transceiver to the interposer and the substrate.

A method and apparatus for inputting a plurality of different circuit schematics designed with printed circuit board (PCB) mountable components; extracting circuit topologies for said plurality of different circuit schematics; transforming said extracted circuit topologies to a fixed number of connection points; and generating a configurable circuit PCB physical layout pattern having said fixed number of connection points such that said PCB mountable components when positioned on one or more of said fixed number of connection points can implement any circuit represented by said plurality of different circuit schematics.

A circuit board includes a board base with a first surface and a second surface that is located opposite the first surface. A plurality of first coupling pads are located on the first surface of the board base. A plurality of second coupling pads are located on the second surface of the board base. The first coupling pads and the second coupling pads define a coupling pad footprint. A breakout via system is included in the board base. The breakout via system includes a plurality of primary signal vias that are located in the board base and outside of the coupling pad footprint, a plurality of first primary signal via connections that extend between the primary signal vias and the plurality of first coupling pads, and a plurality of second primary signal via connections that extend between the primary signal vias and the plurality of second coupling pads.

The present disclosure provides a flexible circuit board. The flexible circuit board includes a substrate; a conductive layer, disposed on the substrate; and a cover layer, disposed on a side of the conductive layer facing away from the substrate. The flexible circuit board is provided with a through hole penetrating through the flexible circuit board in the thickness direction. The cover layer includes a hollowed-out region located at least at an edge of one side of the through hole. The conductive layer includes an electrostatic discharge section exposed in the hollowed-out region.

An electronic device according to various embodiments comprises: a circuit element; a printed circuit board comprising a first connection pad connected to the ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a flexible printed circuit board (FPCB) comprising a coupling part connected to the printed circuit board, and a connection part extending from the coupling part, wherein the FPCB comprises first ground wiring connected to the first connection pad and extending from the coupling part to the connection part in an assigned direction, second ground wiring connected to the second connection pad and extending from the coupling part to the connection part in the assigned direction, signal wiring connected to the third connection pad and extending from the coupling part to the connection part in the assigned direction, while being arranged between the first ground wiring and the second ground wiring, and third ground wiring arranged in an opposite direction to the assigned direction so as to be connected, in the coupling part, to the first ground wiring and the second ground wiring and surround the signal wiring. Other various embodiments are possible.