A circuit board is provided. The circuit board includes a first pin row, a second pin row and a plurality of signal vias. The first pin row includes a first side and a second side opposite to each other. The second pin row includes a first side and a second side opposite to each other. A plurality of traces of the circuit board are electrically connected to a plurality of pins of the first pin row and a plurality of pins of the second pin row respectively through the signal vias. Four consecutive signal vias of the signal vias are sequentially disposed at the first side of the first pin row, the first side of the second pin row, the second side of the first pin row, and the second side of the second pin row.

A method for forming a circuit board includes forming a first dielectric layer, a first circuit layer in the first dielectric layer, a second circuit layer on the first dielectric layer, and a plurality of conductive vias in the first dielectric layer and connecting the first circuit layer to the second circuit layer; forming a second dielectric layer on the first dielectric layer and the second circuit layer; forming a plurality of openings in the second dielectric layer to expose a plurality of parts of the second circuit layer; forming a seed layer on the exposed parts of the second circuit layer and sidewalls of the openings; and forming a plurality of bonding layers on the seed layer, wherein the bonding layers and the seed layer are made of copper, and the bonding layers are porous.

The present disclosure provides a flexible circuit board. The flexible circuit board includes a substrate; a conductive layer, disposed on the substrate; and a cover layer, disposed on a side of the conductive layer facing away from the substrate. The flexible circuit board is provided with a through hole penetrating through the flexible circuit board in the thickness direction. The cover layer includes a hollowed-out region located at least at an edge of one side of the through hole. The conductive layer includes an electrostatic discharge section exposed in the hollowed-out region.

A printed circuit board includes a top conducting layer, an escaping layer, one or more first reference layers interposed between the top conducting layer and the escaping layer, and a second reference layer disposed under the escaping layer. The top conducting layer includes two connecting pads for receiving a pair of differential signals. A pair of vias are provided to extend vertically to penetrate the one or more first reference layers, the escaping layer, and the second reference layer. The vias connects the top conducting layer with the escaping layer. Each of the one or more first reference layers includes a continuous via void surrounding the pair of vias. The second reference layer includes two round via voids each surrounding one of the vias. The second reference layer includes a conductive film disposed between the two round via voids.

A printed circuit board comprises a board main body, a sensor, an external connection pad, and a hollow-structured electrical conductor. The board main body has a top face and a bottom face opposite the top face. The sensor is mounted on one of the top face and the bottom face of the board main body. The external connection pad is provided on the top face or the bottom face of the board main body opposite the sensor. The hollow-structured electrical conductor extends through the board main body and electrically connects the sensor to the external connection pad.

An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

An electronic device includes a printed circuit board (PCB). The PCB includes first and second grids disposed at a top surface and a bottom surface of the PCB, respectively. Each grid includes a plurality of footprint pins, and a plurality of vias extending through the PCB to the top and bottom surfaces. Each footprint pin includes a connecting end and a free end that opposes the connecting end. Each via includes a contact end located at one of grids and is in electrical contact with the connecting end of one of the footprint pins, and each via further includes a non-contact end that is located at the other of the grids and is not in electrical contact with any of the footprint pins. First and second connectors are mounted to the PCB top and bottom surfaces and connect with the footprint pins of the first and second grids.

Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

A circuit board is provided. The circuit board includes a first pin row, a second pin row and a plurality of signal vias. The first pin row includes a first side and a second side, wherein the first side of the first pin row and the second side of the first pin row are opposite to each other. The second pin row includes a first side and a second side, wherein the first side of the second pin row and the second side of the second pin row are opposite to each other. A plurality of traces of the circuit board are electrically connected to a plurality of pins of the first pin row and a plurality of pins of the second pin row respectively through the signal vias. Three consecutive signal vias of the signal vias are sequentially disposed at the first side of the first pin row, the first side of the second pin row, and the second side of the first pin row.