The present application provides a circuit substrate and a method of managing the placement of one or more groupings of a plurality of capacitors coupled to a circuit substrate. Each capacitor has a pair of terminals, as well as a component shape which changes as a voltage difference is selectively applied across the pair of terminals. When a voltage difference is applied across the pair of terminals, the component shape of the capacitor will contract in a first direction and expand in a second direction, where the second direction is substantially orthogonal to the first direction. When the voltage difference is removed from the pair of terminals, the component shape of the capacitor will return to an uncontracted state in the first direction and an unexpanded state in the second direction. Each of the plurality of capacitors in a particular grouping is driven by a complementary signal. The method includes arranging each of the plurality of capacitors in the particular grouping, which are positioned within a relative distance of one another that is less than or equal to a quarter wavelength of a predetermined frequency, where at least some of the plurality of capacitors in the particular grouping are positioned to exert opposite influences on the circuit substrate relative to other capacitors in the particular group, in response to the plurality of capacitors in the particular grouping being driven by the complementary signal.

The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

An electrical conductor of a through-hole inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for through-hole mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and also has an unbent distal end configured for through-hole mounting to the circuit board. The straight leads each have a height which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.

The present application provides a circuit substrate and a method of managing the placement of one or more groupings of a plurality of capacitors coupled to a circuit substrate. Each capacitor has a pair of terminals, as well as a component shape which changes as a voltage difference is selectively applied across the pair of terminals. When a voltage difference is applied across the pair of terminals, the component shape of the capacitor will contract in a first direction and expand in a second direction, where the second direction is substantially orthogonal to the first direction. When the voltage difference is removed from the pair of terminals, the component shape of the capacitor will return to an uncontracted state in the first direction and an unexpanded state in the second direction. Each of the plurality of capacitors in a particular grouping is driven by a complementary signal. The method includes arranging each of the plurality of capacitors in the particular grouping, which are positioned within a relative distance of one another that is less than or equal to a quarter wavelength of a predetermined frequency, where at least some of the plurality of capacitors in the particular grouping are positioned to exert opposite influences on the circuit substrate relative to other capacitors in the particular group, in response to the plurality of capacitors in the particular grouping being driven by the complementary signal.

A lighting module of a motor vehicle signaling device includes a ceramic substrate having opposite first and second faces, and a plurality of selectively activatable light sources mounted on the first face of the ceramic substrate. Each of the first and second faces of the ceramic substrate are provided with at least a first and a second respective interconnection layer. The ceramic substrate comprises a plurality of through holes designed to interconnect the first interconnection layer to the second interconnection layer.

An electronic device is provided that includes a vertical chassis wall having an aperture; a horizontal circuit board that extends toward the vertical chassis wall; an F-connector connected to the horizontal circuit board on a first side and extending out of the vertical chassis wall through the aperture; and an inner shield that shields a radiofrequency circuit components mounted on the first side of the circuit board. The inner shield includes tabs that extend partially into solder plated clearance holes in the horizontal circuit board and are reflow-soldered into the clearance holes. The tabs have distal ends that terminate between a plane of the first side and a plane of a second side of the circuit board.

Disclosed is a DC/DC partial power converter (PPC), comprising a plurality of first switching cells; a capacitive energy storage element; a plurality of second switching cells; and a printed circuit board (PCB). A power input terminal of the respective first switching cell is connectable to a respective DC power source. Power output terminals of the respective first switching cell and power input terminals of the respective second switching cell are connected in parallel to the capacitive energy storage element. A power output terminal of the respective second switching cell is connectable to a DC power output bus. The respective first or second switching cell comprises at least one die package being embedded in the PCB. Electrical terminals of the respective at least one embedded die package are connected with corresponding electrical terminals on the PCB. This improves a power density and cost of DC/DC partial power converters.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

A method for connecting two objects electrically by an electroconductive liquid is described. The method includes providing a substrate having a first surface and a second surface opposite to the first surface. Thereafter, the method includes forming a channel of the liquid on the first surface of the substrate to extend along the first surface of the substrate. Further, the method includes forming a through hole in the substrate. Moreover, the method includes arranging the two objects to interpose the substrate, wherein the two objects overlap with the openings of the through hole. Next, the method further includes filling the liquid to the through hole via the channel, bringing the liquid in contact with the two objects, and hardening the liquid. Further still, the method further includes wherein a surface of the liquid hole bulges to form a projection which makes contact with one of the two objects.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.