A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

A circuit arrangement for capturing a position change of a component, comprising a printed circuit board. The component comprises a component portion with which the component is arranged on the printed circuit board and is aligned therewith. At least one movement direction is provided, in which the component moves in the event of a position change. At least one resistor is arranged in the movement direction with a tolerance distance from the component portion such that, in the event of a position change of the component, the tolerance distance is exceeded so that the component portion shears the resistor.

A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact portion disposed on the first connection portion; a first device disposed on the first connection portion through the first contact portion; a second contact portion disposed under a lower surface of a second-first circuit pattern of the second outer circuit pattern; a second device attached to the second-first circuit pattern through the second contact portion; and a second connection portion disposed under a lower surface of a second-second circuit pattern of the second outer circuit pattern; wherein the first connection portion is disposed with a first width and a first interval, and wherein the second connection portion is disposed with a second width greater than the first width and a second interval greater than the first interval.

A printed circuit board assembly includes a printed circuit board with an upper face, a lower face, multiple metal layers, and multiple electrically insulating layers. The printed circuit board assembly additionally includes a metal heat sink on which the lower face of the printed circuit board lies at least in some regions, wherein the metal heat sink has a heat sink potential. The bottom metal layer of the printed circuit board is set to the heat sink potential while the other metal layers of the printed circuit board have an electric potential which deviates therefrom.

A power stage includes a PCB; two groups of transistors, where a first electrode of the low-side transistor is connected to a second electrode of the high-side transistor, a first via hole and a second trace; a first packaging layer covering the low-side transistor; a second packaging layer covering the high-side transistor; an exposed first redistribution layer, including a first redistribution portion covering a portion of a first side surface of the first package layer; a second redistribution portion covering a portion of a second side surface of the first package layer; the third redistribution part covering a portion of a third side surface of the second package layer; the fourth redistribution portion covering a portion of a fourth side surface of the second package layer; the fifth redistribution portion covering a portion of a fourth side surface of the second package layer away from the surface of the PCB.