A surface-mount connector includes, a connector body, connection terminals provided to the connector body that are placed on terminal solder portions on a surface of a circuit board, and a positioning portion provided to the connector body that includes a solder portion being press-fitted into a through-hole of the circuit board with the connection terminals placed on the terminal solder portions.

A solder paste is printed on a first surface of a sheet. Connectors are mounted on a first surface of a first board and a second surface of a second board. The sheet is inverted. A solder paste is printed on a second surface of the sheet. Connectors are mounted on a second surface of the first board and a first surface of the second board. The solder paste printed onto the second surface of the sheet is melted. The first board is separated from the second board. The first and second board have the same connector layout. A first connector soldered to the first surface of the first board and a second connector soldered to the second surface of the second board are disposed at a location where the sheet can be bent and broken along the separation line.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

To provide a technology capable of improving efficiency in a mounting process of disposing a large number of identical parts such as LED elements on a circuit board. An optical light emitting device includes: packages of a plurality of regular polyhedra each having a light emitting element; and a board having a plurality of mounting holes fitted with three surfaces of the regular polyhedral packages. In the optical light emitting device, the exterior of each of the regular polyhedra in the regular polyhedral packages is comprised of a transparent member. Each of the regular polyhedral packages includes: first electrodes each provided at each top; and second electrodes each provided on a straight line connecting the two tops, each of the first electrodes is connected to one electrode of the light emitting element, and each of the second electrodes is connected to the other electrode of the light emitting element.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

Once variation of a method for producing a smart yarn includes: advancing a set of wires into an assembly field; at each sensor site in a series of sensor sites along the set of wires, depositing solder paste onto the set of wires at the sensor site, placing a sensor into the solder paste on the set of wires at the sensor site, and heating the set of wires within the assembly field to reflow the solder paste; wrapping fibers around the set of wires and sensors arranged along the set of wires to form a continuous length of the smart yarn; separating a first segment of the smart yarn from the continuous length of the smart yarn; and weaving the first segment of the smart yarn into a garment.

The present invention is provided with a solder paste including an additive element without segregation of a low-melting phase while acquiring an additive effect of the additive element in a solder joint that joins electrodes of an electronic component and a printed circuit board. The solder paste is used for mounting an electronic component on a printed circuit board. The solder paste includes a tin-silver-copper based solder alloy to which an additive element other than tin, silver, and copper is added. The solder alloy contains the additive element adjusted to an amount greater than or equal to a minimum amount for exhibiting an additive effect and less than or equal to a solid solubility limit in a solder joint formed between electrodes of the printed circuit board and the electronic component when the electronic component is mounted on the printed circuit board.

An electrical power supply device for at least one light source of the light emitting diode type and at least one electronic component, including a circuit for driving the electrical power supply of the light source or each light source, the drive circuit including at least one electrical conductor track and a housing for accommodating an insert, and an insert in an electrically conducting material, the insert being inserted in the accommodation housing and including a first end portion electrically connected to the conductor track, and a second end portion suited to being electrically connected to at least one electronic component so as to supply electrical power to the electronic component.

A wireless power transmitting apparatus can include a circuit board; a shielding plate on the circuit board; a first transmitting coil on the shielding plate, the first transmitting coil comprising a first plurality of lead wires; a second transmitting coil on the first transmitting coil, the second transmitting coil comprising a second plurality of lead wires; and a plurality of connectors outside the first transmitting coil and the second transmitting coil, the plurality of connectors connected with the first plurality of lead wires and the second plurality of lead wires, in which a first lead wire of the first plurality of lead wires emerges from below the second transmitting coil, a first lead wire of the second plurality of lead wires emerges from on the first transmitting coil, in which the shielding plate comprises a plurality of guide portions below the second transmitting coil, and the first plurality of lead wires and the second plurality of lead wires are electrically connected to the circuit board through the plurality of connectors.