A mounting device and a method for mounting an object on a circuit board are provided. The mounting device has an abutting portion and at least one pin. The mounting method includes disposing multiple the mounting devices on the circuit board, passing pins of each mounting device through multiple plated holes of the circuit board and soldering the pins in the plated holes, making through holes of the object go through the mounting devices, bending the abutting portion to abut an edge of an opening of the through holes of the object, and thereby mounting the object on the circuit board via the multiple mounting devices as well as grounding the object. Since the mounting device is firmly mounted on the circuit board by soldering; it is easy to assembly because the mounting device is soldered by a solder oven.

To provide a technology capable of improving efficiency in a mounting process of disposing a large number of identical parts such as LED elements on a circuit board. An optical light emitting device includes: packages of a plurality of regular polyhedra each having a light emitting element; and a board having a plurality of mounting holes fitted with three surfaces of the regular polyhedral packages. In the optical light emitting device, the exterior of each of the regular polyhedra in the regular polyhedral packages is comprised of a transparent member. Each of the regular polyhedral packages includes: first electrodes each provided at each top; and second electrodes each provided on a straight line connecting the two tops, each of the first electrodes is connected to one electrode of the light emitting element, and each of the second electrodes is connected to the other electrode of the light emitting element.

Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

Microelectronic devices and systems include a decoupling capacitor module having any number of capacitors attached to a surface of a substrate such as a cored or coreless microelectronics board. The decoupling capacitor module is attached, by an opposing surface of the substrate, to a number of capacitors that are, in turn, mounted on a board such as a motherboard. Substrate mounted capacitors are vertically aligned with corresponding board mounted capacitors to provide vertically stacked capacitors.

An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.

The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.

The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers.

An electrical power supply device for at least one light source of the light emitting diode type and at least one electronic component, including a circuit for driving the electrical power supply of the light source or each light source, the drive circuit including at least one electrical conductor track and a housing for accommodating an insert, and an insert in an electrically conducting material, the insert being inserted in the accommodation housing and including a first end portion electrically connected to the conductor track, and a second end portion suited to being electrically connected to at least one electronic component so as to supply electrical power to the electronic component.

After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.