A safety switching device for controlling a load having at least one input for receiving an input signal and one output for outputting an output signal, and having an electrical circuit which provides the output signal as a function of the input signal. The electrical circuit is arranged on a printed circuit board and is coupled to at least one setting component for setting an operating parameter of the safety switching device. The surface of the printed circuit board defines a mounting plane, and the at least one setting component has an adjusting element in a housing and is arranged recessed on the printed circuit board so that the housing of the adjusting element intersects the mounting plane.

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.

A light source structure, an electronic device and a manufacturing method of a light source structure are disclosed. The light source structure includes a light-emitting unit, a printed circuit board and a bonding layer. The light-emitting unit includes a substrate and at least one light-emitting element on the substrate. The printed circuit board includes a first surface, and the light-emitting unit is disposed on the first surface of the printed circuit board via the substrate. The bonding layer is disposed between the substrate and the first surface of the printed circuit board, and for adhesively bonding the substrate and the printed circuit board together.

An integrated circuit printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

An electrical connector includes a housing having contact chambers between a top and a bottom configured to be mounted to a circuit board. A rear wall of the housing includes lead slots open at the top to receive leads of an electrical component. The electrical connector includes a cover coupled to the top of the housing above the leads. The electrical connector includes contacts received in corresponding contact chambers. Each contact includes a base having a solder pad at a bottom configured to be soldered to a circuit board conductor of the circuit board. Each contact includes contact beams extending from the base to form a socket proximate to the top of the housing that receives the lead of the electrical component from above to electrically connect to the lead of the electrical component.

Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

According to one embodiment, an integrated circuit includes a chip, a first pin, a second pin, and a third pin. The chip includes an internal circuit and a plurality of pads connected to the internal circuit. The first pin is connected to a first pad among the plurality of pads. The first pin is connected to a power supply provided outside the integrated circuit. The second pin is connected to a second pad among the plurality of pads. The second pin is connected to a ground provided outside the integrated circuit. The third pin is connected to the second pin inside the integrated circuit via a third pad among the plurality of pads. The third pin is insulated from the second pin outside the integrated circuit.

An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Intraluminal ultrasound imaging device, systems and methods are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.