RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

The disclosure provides an electronic device including a substrate, at least one conductive composite structure, and an electronic element. The at least one conductive composite structure is disposed on the substrate. The at least one conductive composite structure includes a first metal layer, a second metal layer, and a third metal layer. The second metal layer is located between the first metal layer and the third metal layer, and the thickness of the second metal layer ranges from 0.5 μm to 12 μm. The electronic element is disposed on the at least one conductive composite structure and bonded to the at least one conductive composite structure.

A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material and the electronic leadless module have an anchoring region on at least one side face. The package may also include a carrier frame which carries the electronic leadless module, with the side face extending further in the direction of the carrier frame below the anchoring region than in the anchoring region, and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.

A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.

A sheet-shaped solder that is not susceptible to electromigration, and a solder joint part and semiconductor device using the same are provided. A pressed sheet-shaped solder containing a solder alloy containing Sn as a primary component, an additional element, and an incidental impurity is provided. A pressed surface of the sheet-shaped solder is a surface perpendicular to a main surface of the sheet-shaped solder, and c-axes of Sn crystals are aligned in a direction perpendicular to a thickness direction of the sheet-shaped solder. Moreover, a solder joint part including a semiconductor element, and an electrically conductive connection member, and a solder joining layer being the above sheet-shaped solder melted between the semiconductor element and the electrically conductive connection member is provided.

An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.