H05K5/0269

ELECTRONIC APPARATUS
20230354536 · 2023-11-02 · ·

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

ELECTRONIC APPARATUS
20220248554 · 2022-08-04 · ·

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

MULTI-FUNCTIONAL FRONT SLICE PANEL APPARATUS AND METHOD OF MANUFACTURE

A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.

Multi-card subsystem for embedded computing systems

A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.

Server

A server includes a case, a mounting frame, a heating element, a connecting plate, and a cooling mechanism. The heating element, the connecting plate, and the cooling mechanism are mounted on the mounting frame. The heating element is detachably mounted on the connecting plate. The cooling mechanism is coupled to the heating element. The mounting frame is detachably mounted in the case. The connecting plate includes a plug portion configured to plug with an operating mechanism mounted in the case.

CONNECTOR

A connector is provided with a base, a terminal, a cover and a heat conductive member. The base has a holding portion, and the terminal is held by the holding portion. The cover is provided with a main portion having an inner surface and an outer surface. The heat conductive member is fixed on the inner surface. When the connector is connected to a card-type device, the terminal pushes a card-type device against the heat conductive member in a predetermined direction perpendicular to a circuit board. When the connector is connected to the card-type device, an interval between the main portion and the holding portion is kept constant in the predetermined direction.

ELECTRONIC APPARATUS
20210136941 · 2021-05-06 · ·

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

SERVER

A server includes a case, a mounting frame, a heating element, a connecting plate, and a cooling mechanism. The heating element, the connecting plate, and the cooling mechanism are mounted on the mounting frame. The heating element is detachably mounted on the connecting plate. The cooling mechanism is coupled to the heating element. The mounting frame is detachably mounted in the case. The connecting plate includes a plug portion configured to plug with an operating mechanism mounted in the case.

Electronic apparatus
10905021 · 2021-01-26 · ·

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Multi-socket server assembly

In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface.