An electrical connector includes an insulative rectangular housing with a planar base defining opposite upper surface and lower surface thereon. Four restriction parts are formed at four corners of the base to cooperate with the base for commonly forming a receiving cavity to receive the electronic package therein. A plurality of first contacts are disposed in the base with corresponding contacting sections upwardly extending into the receiving cavity to upwardly abut against the corresponding pads on the undersurface of the electronic package. A plurality of second contacts are disposed in the base with corresponding contacting sections sidewardly extending into the receiving cavity to sidewardly abut against the corresponding pads on the side faces of the electronic package.

Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

An electrical connector includes a body provided with multiple accommodating holes running through the body vertically, and multiple terminals correspondingly accommodated in the accommodating holes. Each terminal includes a main body member and multiple conductive members. The main body member has two long edges extending in a front-rear direction and two short edges. The conductive members are arranged in the front-rear direction. Each conductive member has a base electrically connected to the main body member and an elastic arm. The base has a vertical flat plate portion downward covering the main body member. The elastic arm extends upward from an upper end of the flat plate portion. Each elastic arm has at least one contact portion located in front of the corresponding base to be downward abutted by the electronic component and to move downward. Two adjacent terminals in the front-rear direction are separately provided in the front-rear direction.

One embodiment includes a method for manufacturing an electronic apparatus, including bonding an integrated circuit (IC) die to a substrate to form an IC package using a first reflow process, which causes the substrate to warp, reversibly connecting a lid with the IC package over the IC die so that the lid applies a force to the IC die, providing a printed circuit board (PCB) including an array of first contact pads, respectively disposing an array of bonding elements on an array of second contact pads of the substrate, placing the IC package on to the PCB with respective ones of the bonding elements contacting respective ones of the first contact pads, performing a second reflow process to apply heat to the bonding elements to bond the first contact pads with the second contact pads, and removing the lid from the IC package after the second reflow process.

A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

An interposer includes a housing and a contact disposed in the housing. The housing has a first face, a second face opposite the first face, and a passageway penetrating the first face and the second face. The contact has a base portion press-fitted in the passageway, a first contact beam extending obliquely with respect to the first face from the base portion, and a second contact beam extending obliquely with respect to the second face from the base portion. The first contact beam extends outward beyond the first face and has a first contact point portion. The second contact beam extends outward beyond the second face and has a second contact point portion. The first contact point portion and the second contact point portion both extend beyond a penetrated region of the passageway in a direction perpendicular to an insertion direction in which the contact is inserted into the passageway.

An electrical connector includes an insulative housing retaining a plurality of contacts therein. The contact includes a mating part with a first body and a spring arm extending therefrom for mating a conductive pad of a CPU (Central Processing Unit), and a soldering part with a second body and a solder tail extending therefrom for mounting a solder ball thereon. The spring arm is downwardly pressed by the CPU to contact the soldering part when the CPU is mounted upon the electrical connector The mating part and the soldering part are spaced from each other either without any connection, or alternately linked with each other via a bridge transversely connected therebetween wherein the latter may optionally omit the barbed structure from one of the mating part and the soldering part.

An integrated circuit socket includes a housing having a flat plate portion and a plurality of contacts disposed in the housing. The contacts each have a contact beam projecting outwardly from a first surface of the housing and a retained portion disposed in a passageway in the flat plate portion. The contact beam extends from the retained portion. The retained portion has a base portion with a flat-plate shape and a pair of side portions extending at an angle with respect to the base portion on a pair of opposite sides of the base portion. A cross-section of the retained portion parallel to the first surface has a U-shape.

A socket assembly includes a socket connector including a socket substrate having an upper surface and a lower surface, upper socket contacts on the upper surface configured to be terminated to an electronic package and lower socket contacts configured to be terminated to a host circuit board. The socket connector includes first and second power contacts. The first power contact is configured to be terminated to the electronic package. The socket assembly includes a power connector terminated to the socket substrate having a power connector terminal electrically connected to the second power contact. The socket substrate is configured to electrically connect the power connector to the electronic package through the first power contact and the second power contact.