A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A securing mechanism for retaining a CPU to an electrical connector mounted upon a top surface of the PCB, includes a fastening device mounted upon the top surface of the PCB beside the electrical connector, and a back plate mounted upon the undersurface of the PCB and located between the PCB and a metallic case. The fastening device cooperates with the back plate to be secured to the PCB via a first set of fixing units. The case forms an opening/recessed region to receive a thickened central region of the back plate and is secured to the back plate via a second set of fixing units surrounding said opening. The thickened central region is fully received within the opening in the vertical direction. The first set of fixing units are located in the central region of the back plate.

In accordance with embodiments of the present disclosure, an information handling system may include a chassis and a retention assembly mechanically coupled to the chassis and configured to retain an information handling resource card. The retention assembly may include a fixed member, a movable member mechanically coupled to the fixed member such that the movable member is movable relative to the fixed member in a linear axis, and at least one fastener configured to mechanically engage with the fixed member in order to maintain the movable member in a desired position relative to the fixed member.

A method, an information handling system (IHS), and a bracket component for use in an IHS to better retain an inserted expansion card. The bracket component includes a first arm with a surface configured to fasten to a portion of a computer chassis. The portion of the computer chassis is proximate to a printed circuit board (PCB) expansion slot of the computer chassis. The bracket component includes a second arm positioned perpendicular to the first arm. The second arm has an inner surface facing the PCB expansion slot. The bracket component includes a board support pad affixed to the inner surface of the second arm. The board support pad has a flexible surface layer for abutting an edge of one or more PCBs that are inserted into the PCB expansion slot. The board support pad of the bracket component stabilizes the PCBs and reduces vibrations emanating from the computer chassis.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

A card may include a circuit board, a cable configured to communicatively couple the circuit board to a motherboard, a connector configured to receive an expansion card to communicatively couple the expansion card to the motherboard, and a detent assembly configured to mechanically couple the card to the motherboard. The detent assembly may include a pin mechanically coupled to a surface of the circuit board and extending from the surface of the circuit board and configured to mechanically engage with a first feature of the mechanical post in order to align the card to the motherboard and a detent mechanically coupled to the pin and having an annular shape, the detent configured to mechanically engage with a second feature of the mechanical post in order to mechanically retain the card with the motherboard.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for duster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A card edge connector includes an insulative elongated housing defining an elongated slot extending along a longitudinal direction. Two rows of contacts are disposed in the housing so as to be paired in each cross-sectional plane in a transverse direction. A pair of towers are located at two opposite ends of the housing in the longitudinal direction. A pair of ejectors/lockers are disposed in the corresponding towers and rotational about a pivot extending along the transverse direction. Each ejector has a bottom kicker adapted to intimately confront a bottom edge of the memory module for ejecting the memory module out of the housing. The kicker slightly interferes with the contacting sections of the neighboring contacts when the ejector is located at an outer position so as to be retained in position with regard to the housing.