A power apparatus includes a first power bus bar provided at a first power part, a second power bus bar provided at a second power part coupled to the first power part while communicating internally with the first power part, the second power bus bar being fastened to the first power bus bar, a first interlock bus bar provided at the first power part while being connected to an interlock terminal of a controller disposed within the first power part, a second interlock bus bar provided at the second power part while being fastened to the first interlock bus bar, and a safety cover fastened to a fastening portion between the first interlock bus bar and the second interlock bus bar while covering a fastening portion between the first power bus bar and the second power bus bar.

A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.

A semiconductor device includes a plurality of semiconductor chips, an insulating part, a first electrode, a second electrode, a first bus bar, and a second bus bar. The insulating part surrounds the semiconductor chips. The first electrode is in pressure contact with the semiconductor chips. The semiconductor chips are sandwiched between the first electrode and the second electrode in a first direction. The second electrode is in pressure contact with the semiconductor chips. The first bus bar is connected to the first electrode. The second bus bar is connected to the second electrode. The first bus bar and the second bus bar sandwich the insulating part in a second direction intersecting the first direction.

A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.

A power converter includes a semiconductor modules, a capacitor, a housing, a shield layer and a collar member. The capacitor is electrically connected to the semiconductor modules. The housing houses at least the semiconductor modules and the capacitor. The shield layer is electrically conductive and provided on and covers at least one of inner and outer surfaces of the housing. The collar member is electrically conductive and integrated with the housing. The collar member is configured to allow a fastener to be inserted through the collar member such that the housing is fixed to a vehicle-side member via the fastener. The collar member is electrically conductively joined to the shield layer.

A power semiconductor module includes a housing accommodating a power circuit with at least one power semiconductor chip, the housing providing at least two power terminals; a printed circuit board mounted to the housing and electrically connected to the power circuit for distributing auxiliary signals; and at least one auxiliary terminal mounted to the printed circuit board with a press-fit connection provided by a body of the auxiliary terminal.

The invention relates to a power converter assembly including at least two power converter units; a busbar; at least two connecting elements, each connecting element electrically connecting one of said power converter units to the busbar, thereby interconnecting the at least two power converter units; and at least one converter housing, enclosing and shielding at least one of said power converter units. It further includes a busbar housing in which the busbar is contained and shielded, wherein the at least two connecting elements are electrically isolated from the busbar housing and from the at least one converter housing. The invention further relates to a working machine and a power system including said power converter assembly.

An electronic system includes a power electronics module for converting a DC current to an AC current. The power electronics module includes a first busbar and a second busbar for supplying the power electronics module with the DC current, a third busbar able to supply a phase winding of a rotating electric machine, and a control pin receiving a control signal for driving the power electronics module. An electronic control module separate from the power electronics module is configured so as to generate the control signal. The electronic control module includes an electronic measuring device, a support including an opening and carrying the electronic control module on a first side of the support, a measurement housing including a cavity, the measurement housing being located on a second side of the support opposite the first side of the support. The electronic measuring device penetrates into the opening in the support and into the cavity in the measurement housing. A sealing means providing a seal between the measurement housing and the support.

A semiconductor module includes a base member including a circuit board on which a positive electrode pad and a negative electrode pad are provided and on which a semiconductor device is mounted to be electrically coupled to the positive electrode pad and the negative electrode pad, a housing that is attached to the base member so as to surround the positive electrode pad and the negative electrode pad, the housing being formed in a frame shape, a first electrode plate that is electrically coupled to the positive electrode pad, the first electrode plate having a flat plate portion, and a second electrode plate that is electrically coupled to the negative electrode pad, the second electrode plate having a flat plate portion. The flat plate portion of the first electrode plate and the flat plate portion of the second electrode plate are arranged in a parallel-plate configuration within the housing.