A circuit structure includes a first busbar constituted by a cladding material, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, and an electronic component provided on the first busbar and the second busbar so as to straddle the insulating portion. The electronic component has a connection terminal bonded to the first busbar.

An inverter power assembly includes: a mounting frame; a power module mounted on the mounting frame; and a capacitor electrically connected to the power module. The inverter power assembly has the power module mounted on the mounting frame and the capacitor electrically connected to the power module, which leads to a simple and compact structure and a reasonable arrangement for the entire inverter power assembly.

A power semiconductor module has a substrate, with power semiconductor components, and a DC voltage connecting device, which has a first and a second flat conductor connecting element and at least one first metal layer connecting element and at least one second metal layer connecting element, wherein the second flat conductor connecting element is arranged spaced apart in the normal direction of the first flat conductor connecting element from the first flat conductor connecting element, the first flat conductor connecting element is electrically connected by the first metal layer connecting element and the second flat conductor connecting element is electrically connected by the second metal layer connecting element to the metal layer, the first flat conductor connecting element has a flat conductor end section and a flat conductor connection section arranged between the one first metal layer connecting element and the flat conductor end section.

In a power conversion device, cable connection positions of connections in which a plurality of bus bars is respectively connected to external line cables are non-overlapping with each other as viewed from a side on which the external line cables are pulled out.

This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

Circuit board, defining a plurality of switching arms connected in parallel so as to convert a first voltage into a second voltage, at least one of which is DC voltage. The board includes a plurality of controllable electronic switches mounted pairwise in series on either side of a midpoint, so as to produce the switching arms connected in parallel. A plurality of decoupling capacitors are connected in parallel to one another, and in parallel to the DC voltage. Two electrically conductive layers are arranged parallel to one other, one of which is at the highest potential of the DC voltage and the other of which is at the lowest potential of the DC voltage. Each of the decoupling capacitors having one terminal connected to one of these electrically conductive layers and its other terminal connected to the other of these electrically conductive layers.

A power module apparatus includes a power substrate, at least one power device electrically connected to the power substrate and a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device, a housing secured to the power substrate, and a clamping circuit electrically connected to the at least one power device. The clamping circuit being configured to reduce a voltage charge up at a gate of the at least one power device to within 8 V of a desired voltage.

A high power connector comprises an electricity conductive element of substantially elongated conformation and provided with a first end portion electrically connectable to a power electronic circuit of a power electronic apparatus and with a second end portion provided with an electrical connection terminal, the conductive element being insertable inside a through opening made on the cover with said terminal facing outwards, wherein the connector comprises a locking element made of an electrically insulating material that can be coupled with the conductive element and fixable to the outer surface of the cover.

The power unit includes: a substrate having a first side surface at a first side thereof; a tablet structure located at the first side of the substrate; and a power structure configured to be pressed against the first side surface by the tablet structure. The power unit uses the tablet structure to press the power structure against the first side surface of the substrate, thereby achieving a firm and reliable installation of the power structure on the substrate.