Patent classifications
H05K7/14339
Shielding Arrangement for High Voltage Equipment
A shielding arrangement can be provided for a piece of high voltage equipment spaced from a neighboring object. The piece of high voltage equipment has a first electric potential and the neighboring object has a second electric potential. The shielding arrangement includes a resistor, a shield element for connection to the high voltage equipment via the resistor, and a capacitor connected in parallel with the resistor. A resistance of the resistor and a capacitance of the capacitor together define a time constant in a range of 10 μs-50 ms.
Inhibitor Module and Shielding Arrangements for High Voltage Equipment
The invention is concerned with an inhibitor module arrangement, a shielding arrangement comprising an inhibitor module and a converter station comprising a converter and a shielding arrangement. The inhibitor module arrangement comprises a first string, a second string, and at least one first inhibitor module (30), where the first string comprises resistors (R1), the second string comprises capacitors (C1, C2, C3), the first string is physically separated from and electrically connected in parallel with the second string and the at least one first inhibitor module (30) comprises a first electrical connection terminal (32) at a first end for connection to a piece of high voltage equipment, a second electric connection terminal (34) at a second end for connection to a first shield element for this piece and a closed interior comprising at least one of the strings electrically connected between the first and the second electrical connection terminals (32, 34).
HOLDING AND EXCHANGING DEVICE AND METHOD FOR POWER MODULES
The invention relates to a method and a modular holding and exchanging system (1) for medium or high voltage converters, preferably a modular multilevel converter, comprising a rack (2) for receiving at least two power modules (3) arranged on top of one another in receiving spaces (4), wherein the rack (2) has at least two pairs of vertical standing elements (5) and at least two carrier elements (6) connecting the vertical standing elements (5) in a longitudinal direction (10) of the rack (2) in a horizontal support plane (9), a lifting tool (7) that can be coupled with the rack (2), which lifting tool (7) comprises at least one, preferably at least two, rolling bodies (19) that can be adjusted between a rest position (13) and a support and/or service position (14) for temporarily raising and/or moving a power module (4), wherein the power modules (4) have support surfaces (16) projecting in a transverse direction (11) with respect to a housing width (15) for being supported on the carrier elements (6), and the carrier elements (6) have an upper side (17) provided for at least parts of the support surface (16) of the respective power module (4) to rest on, and are configured as a profile element such that every carrier element (6) has at least one, preferably at least two passages (18), each, that are spaced apart from one another in the longitudinal direction (10), for at least one rolling body (19) to pass through in the service position (14) of the lifting tool (7), and wherein the lifting tool (7) comprises a longitudinally extended profile body (21), preferably a hollow body, configured so as to be insertable into the profile element of the carrier element (6) in the rest position (13), in which profile body (21) a lever device (20) is formed for adjusting the at least one rolling body (19), preferably of the at least two rolling bodies (19), which are spaced apart from one another in the longitudinal direction (10), from the rest position (13) into the service position (14).
POWER MODULE WITH DEFINED CHARGE-REVERSAL PATH AND PRODUCTION METHOD
The invention relates to a method for producing a power module (1) and a power module (1), in particular for a medium or high voltage converter (2), comprising at least one power semiconductor module (3), at least one energy storage module (5), at least one cooling device (7), at least two busbars (10), wherein the cooling device (7) is configured to be electrically conductive and is connected to a protective housing (19) shielding at least the power semiconductor module (3) from the environment, which protective housing (19) has at least one insertion opening (20) for inserting and fastening a connecting element (15), and an electrically conductive connecting element (15) is arranged at a predefinable connection position (16) between at least the cooling device (7) and one of the busbars (10) for forming a defined charge-reversal path (17).
Interference limiting enclosure for power flow devices
An enclosure includes a power flow control device to attach to a high voltage transmission line, a plurality of panels formed of metal, a shorting connection provided between each pair of panels, an electrical connection from at least one panel of the plurality of panels to the high voltage transmission line, a receiving region provided on each panel for each shorting connection, and an equipotential surface for reducing electromagnetic interference from the high voltage transmission line to internal components of the power flow control device, and from the internal components of the power flow control device to the high voltage transmission line.
Method of changing a switching module using pressure-applying device
A switching module may include a plurality of cooling plates stacked along a vertical direction, a switch disposed between the cooling plates, a first supporting member disposed below the lowermost cooling plate, a second supporting member disposed above the uppermost cooling plate, first and second pressing support portions disposed between the lowermost cooling plate and the first supporting member, and a pressing member disposed between the uppermost cooling plate and the second supporting member.
POWER ELECTRONICS ASSEMBLY HAVING A POTTED HIGH VOLTAGE ATTENUATOR CARD FOR A WIND TURBINE
A power electronics assembly for a power generation system includes a housing and an attenuator card positioned within the housing. The attenuator card may include at least one printed circuit board for a high-voltage attenuator circuit. The power electronics assembly also includes a potting material at least partially filling the housing on one or more sides of the attenuator card, a detachable end cap positioned at a first end of the housing, and multi-phase wiring communicatively coupled to the high-voltage attenuator circuit through the end cap.
Power conversion device
A power conversion device includes a first stage, a second stage, a first electric field relaxation shield unit, a second electric field relaxation shield unit, and a plurality of stage posts. The first electric field relaxation shield unit is arranged to surround outer periphery of the first stage. The second electric field relaxation shield unit is arranged to surround outer periphery of the second stage. The plurality of stage posts connect the first stage and the second stage. The plurality of stage posts have outer peripheral surfaces formed of insulating bodies. Power conversion units loaded on the first stage are arranged inside a columnar region which includes at least some of the plurality of stage posts as sides.
POWER MODULE COMPRISING A SUPPORTING COOLING BODY
The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).
CONVERTER ASSEMBLY
A converter assembly includes a converter with converter valves, each having power semiconductor switches. At least one fluid-tight encapsulation housing, in which at least some of the power semiconductor switches are disposed, forms a modular converter unit. The encapsulation housing is at least partially filled with an electrically insulating insulation fluid in order to electrically insulate the power semiconductor switches disposed in the encapsulation housing.