Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

The embodiments include a stackable computing device that includes an integrated heatsink and antenna structure and a housing structure. The housing structure includes a housing casing that surrounds the integrated heatsink and antenna structure. The integrated heatsink and antenna structure includes a heatsink base and one or more radio frequency (RF) antenna portions. The heatsink base includes a connector port that provides an interface between components of the computing device and other computing or peripheral devices. For example, the heatsink base may include platform that is configured to have circuitry fixedly secured on a first side of the platform with a connector of the circuitry aligned with an aperture of the connector port such that a connection to the circuitry is accepted by circuitry of another computing device.

The present invention provides a heat management arrangement for an electronic device, in particular for a handheld electronic device. The heat management arrangement comprises an active cooling means comprising a heat sink and at least one airflow channel configured for convective heat transport to an environment by an airflow. Furthermore, the heat management arrangement comprises a passive cooling means configured to be arranged between the heatsink and a surface of the electronic device and comprising a highly heat conductive substance. The passive cooling means is configured to contact the surface of the electronic device and to enhance heat conduction between the surface of the electronic device and the heat sink. In addition or alternatively, the passive cooling means is configured to enhance heat conduction between the surface of the electronic device and the airflow channel. Furthermore, the invention provides a corresponding method of manufacturing such a heat management arrangement on an electronic device and a corresponding electronic device.

A heat sink for a high voltage switchgear includes: a body. The body is centered around a central axis that extends in an axial direction from a first outer surface of the body to a second outer surface of the body. At least one third outer surface of the body extends from the first outer surface to the second outer surface. At least one air channel extends through the body from the first outer surface to the second outer surface. The at least one air channel is surrounded by the at least one third outer surface.

An electronic device includes a housing, a heat conductive portion, a circuit board, a fin set, and a fan. The housing has an accommodating space. The heat conductive portion is disposed in the accommodating space, and divides the accommodating space into a first space and a second space. The circuit board is disposed in the first space and includes a heat source. The heat source generates heat and is thermally coupled to the heat conductive portion. The fin set is disposed in the second space and thermally coupled to the heat conductive portion. The fan is disposed in the second space and located on one side of the fin set. The fan is adapted to guide an airflow through the fin set to discharge the heat generated by the heat source from the housing.

Provided is a generator that includes a housing, a high-power circuit including a power amplifier, and a low-power circuit. An air flow guidance plate divides the housing into at least two compartments including a high-power compartment and a low-power compartment. The high-power circuit is disposed within the high-power compartment and the low-power circuit is disposed within the low-power compartment.

A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.

An electric fan for producing thrust to propel an aircraft is disclosed. The electric fan comprises a stator, a fan rotor rotatably mounted relative to the stator and an electric motor mounted to the stator and drivingly engaged with the fan rotor to cause rotation of the fan rotor relative to the stator. The fan rotor comprises an annular body defining a flow passage therethrough and a plurality of fan blades disposed in the flow passage and mounted for common rotation with the annular body about a fan rotation axis. The electric motor has a motor rotation axis that differs from the fan rotation axis.

Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

A sensor system for monitoring a device, the sensor system including a housing, a base configured to attach the sensor system to the device to be monitored, a sensor configured to obtain data related to at least one operating parameter of the device, and an integral energy harvesting device configured to provide at least a portion of the energy required to operate the sensor system.