Patent classifications
H05K7/20163
Image capturing apparatus
An image capturing apparatus includes a camera unit, a pair of supporting members, a fixation member, a drive member, a heat generating member, a first cover member, and a second cover member. The second cover member has a first opening into which air from outside flows and a second opening from which air inside the second cover member flows to outside, The fixation member has a third opening into which air that has flowed out of the second opening flows, and a fourth opening from which air inside the fixation member flows to outside. The heat generating member is disposed in a flow channel of air flowing from the first opening to the second opening.
Information handling system with articulated cooling fins between interleaved and separated positions
A portable information handling system rejects excess thermal energy from within a housing by blowing a cooling airflow with a cooling fan across first and second sets of cooling fins and out an exhaust. The cooling fins have an interleaved position with higher impedance and a separated position with a lower impedance that can increase cooling airflow. In one example embodiment, a central processing unit couples to a first circuit board and the first set of cooling fins and a graphics processor couples to a second circuit board and the second set of cooling fins so that movement of the circuit boards moves the cooling fins between the interleaved and separated positions.
Heat exchanger for an electronic display
A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.
THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS
A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
Desktop electronic device
- Brett W. Degner ,
- Caitlin Elizabeth Kalinowski ,
- Richard D. Kosoglow ,
- Joshua D. Banko ,
- David H. Narajowski ,
- Jonathan L. Berk ,
- Michael E. Leclerc ,
- Michael D. McBroom ,
- Asif Iqbal ,
- Paul S. Michelsen ,
- Mark K. Sin ,
- Paul A. Baker ,
- Harold L. Sontag ,
- Wai Ching Yuen ,
- Matthew P. Casebolt ,
- Kevin S. Fetterman ,
- Alexander C. Calkins ,
- Daniel L. McBroom
An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
Multilayer housings
Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.
INFORMATION DISPLAY SYSTEM FOR A VEHICLE
A display system of a vehicle includes a display device disposed in the vehicle and operable to display heads up information for viewing by a driver of the vehicle. The display device includes a mirror, a display screen and a cooling device. The mirror is pivotally mounted at a base plate and is pivotable via a pin of a mounting arm of the mirror moving along a spiral groove of a gear element when the gear element is rotated. The pin is urged towards a side wall of the spiral groove to limit play of the mirror relative to the base plate.
THERMAL MANAGEMENT FOR THERMAL CYCLERS USING AIR TUBES
A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
ELECTRONIC DEVICE
An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.
Heat dissipation device
The heat dissipation device comprises a fluid direction changing part that changes a fluid traveling direction in which a fluid travels. The fluid direction changing part has a base end and a tip. The base end is fixed to a second surface facing a first surface inside a tubular body. The tip is arranged to face multiple fin ends of multiple fins of a heat sink. The fluid direction changing part is entirely or partially arranged downstream of the fluid traveling direction from an upstream end surface of the heat sink. The fluid flows into the heat sink through the upstream end surface, and also passes through a flow path without fin other than a flow path between fins for passage of a fluid formed between the multiple fins to flow into the heat sink through parts of the multiple fin ends exposed at upstream positions from the tip of the fluid direction changing part.