A heating and air purifying apparatus using electronic device heat includes: a cabinet accommodating electronic devices including a central processing unit (CPU), a graphic processing unit (GPU), a power supply unit (PSU), and a main board, having an air inlet on a side, and having an air outlet on a top; one or more partition plates disposed vertically, horizontally, or diagonally across the inner surface of the cabinet; and a discharge fan installed at the air outlet and discharging air in the cabinet to the outside, in which a cooling fan of the GPU is disposed on a side of the one or more partition plate, a GPU body including a graphic card of the GPU is disposed on the opposite side, and the CPU, the PSU, and the main board are accommodated in a space facing a side of the one or more partition plate.

A remote radio unit, which includes a housing, a ventilation air channel, and a circuit component, where the housing is a sealed hollow cavity; the ventilation air channel passes through the housing, a top end of the ventilation air channel is connected to a top end surface of the housing in a sealed manner, and a bottom end of the ventilation air channel is connected to a bottom end surface of the housing in a sealed manner; and the circuit component is disposed inside the cavity, and is in contact with an external surface of a side wall of the ventilation air channel, so that heat generated by the circuit component is dissipated through the ventilation air channel.

A heat dissipating apparatus includes a heat sink, a first air moving device coupled to a first end of the heat sink, and a second air moving device coupled to a second end of the heat sink. The first air moving device drives an airflow to move through the heat sink in a direction and the second air moving device drives the airflow to move through the heat sink in the direction.

A shock pallet assembly allows transport or movement of tall rack-mounted information handling systems (IHSes) without tipping. The shock pallet assembly can resiliently, manually or automatically retract for placement near a wall of a transport conveyance to achieve a greater shipping density of IHSes. The shock pallet assembly can include a bottom structure having a pair of parallel apertures to receive tines of a forklift. Resilient padding is positioned on a top surface of the bottom structure to provide shock dampening. A top deck is attached on top of the resilient padding and bottom structure to form a shock pallet that receives a racked-mounted IHS for transport and movement. An anti-tip mechanism can be attached to a lateral side of the shock pallet to prevent tipping of the rack-mounted IHS.

Electronic equipment (10) has multiple cooling fans (15) for sending air to a heat sink (30). The multiple cooling fans (15) generate airflow (Fh) passing through the heat sink (30) from a first side (H1) to a second side (H2) thereof. The heat sink (30) is arranged obliquely to a crosswise direction and a longitudinal direction of the electronic equipment (10). A sheathing member (40) has an air inlet opening (41i) formed obliquely to the crosswise and longitudinal directions along the first side (H1) of the heat sink (30).

An electrical controller includes a housing, wherein the housing has cooling air openings on two different housing sides. A heat sink is arranged inside the housing, in particular so as to be protected against contact, and forms a cooling air channel, wherein the cooling air channel runs between the cooling air openings of the different housing sides. An electrically insulating holding element is designed to mechanically fix the heat sink inside the housing in a manner electrically insulated from the housing. A number of components to be cooled are provided, wherein the components are thermally conductively coupled to the heat sink and are held by the heat sink.

An assembly of an electrical device includes: at least one electrical functional assembly which has a supporting element and electrical or electronic functional components arranged on the supporting element; a fastening device for fastening the electrical device to a higher-level assembly; a heat sink core element having at least one face wall; and an external element connectable to the heat sink core element. The heat sink core element forms a supporting structure of the electrical device on which supporting structure the fastening device is arranged. The external element is connectable to the heat sink core element such that the at least one electrical functional assembly is accommodated between the at least one face wall of the heat sink core element and the external element.

High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.

A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.

Aspects of the disclosure provide for mitigating a coefficient of thermal expansion (CTE) mismatch between glass components and adjacent metal components in a disk storage device to improve thermal and shock performance. The methods and apparatus provide a hub, provide a first recording disk comprising a glass material and a center hole on the hub such that the hub extends through the center hole of the first recording disk, provide a first spacer on the first recording disk, the first spacer comprising a nickel-iron alloy, and provide a second recording disk comprising a glass material and a center hole on the first spacer such that the hub extends through the center hole of the second recording disk, wherein the first recording disk and the second recording disk each comprise a magnetic recording layer configured to store information.