Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

The present disclosure relates to an IED configured for use as a protection relay in an electric power system. The IED comprises a plurality of cassettes connected to a backplane, with at least two cassettes mounted adjacent each other. Each of the cassettes comprises a housing profile in the form of a rectangular tube having an envelope wall of a heat conducting material, and at least one electronic card arranged in a card slot within the tube formed by the housing profile, which at least one card is electrically connected to the backplane. Adjacent cassettes are separated a distance such that air canals are formed between their respective housing profiles.

In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

In order to give an especially compact, cost-effective and electromagnetically compatible design to a cooling device with a heat sink and a radial fan arranged in or on the receiving area of the heat sink, the bushing is adhesively bonded onto the heat sink in or on the receiving area, or the bushing is integrally designed with the heat sink.

The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).

Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.

Aspects of the disclosure provide for mitigating a coefficient of thermal expansion (CTE) mismatch between glass components and adjacent metal components in a disk storage device to improve thermal and shock performance. The methods and apparatus provide a hub, provide a first recording disk comprising a glass material and a center hole on the hub such that the hub extends through the center hole of the first recording disk, provide a first spacer on the first recording disk, the first spacer comprising a nickel-iron alloy, and provide a second recording disk comprising a glass material and a center hole on the first spacer such that the hub extends through the center hole of the second recording disk, wherein the first recording disk and the second recording disk each comprise a magnetic recording layer configured to store information.

The present disclosure provides a charging pile including a supporting device, a control module and a power module. The control module is fixed on the supporting device and includes a first housing, a control unit and a waterproof device. The first housing has a first opening. The waterproof device is disposed on and surrounding around the periphery of the first opening. The power module is fixed on the supporting device and disposed on the top of the control module. The power module includes a second housing and a power supply unit. The second housing has a second opening, which is in communication with the first opening of the first housing. The control unit is electrically coupled with the power supply unit. The waterproof device is disposed between the first housing and the second housing, and surrounding around the periphery of the first opening and the periphery of the second opening.

A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.

An air shroud includes first and second channels, a center bypass port, and a center deflector. The first channel directs a first airflow over a first heat sink of a first processor. A first hot airflow leaves a first rear portion of the first channel. The second channel directs a second airflow over a second heat sink of a second processor. A second hot airflow leaves a second rear portion of the second channel. The center bypass port directs a third airflow away from a first set of memory modules. The center deflector is in physical communication with the first and second channels. The center deflector directs a first portion of the third airflow to the first rear portion of the first channel, and a second portion of the third airflow to the second rear portion of the second channel.