Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

An oven comprises an interior electronics cavity defined within electronics cavity walls. The oven includes an air inlet for receiving ambient air from an ambient space outside the electronics cavity into the interior electronics cavity and a first air outlet for returning steam laden air from a cooking space to the ambient space outside the cooking space. The oven also includes a second air outlet positioned to separate flow going into the air inlet from flow from the first air outlet. An air plenum can be defined outside of the cooking space, and the air inlet can be defined in a first portion of an exterior interface of the air plenum. The second air outlet can defined in a second portion of the exterior interface.

A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

(Problem) To provide a small light illuminating apparatus configured to uniformly cool a plurality of light emitting diodes (LEDs) (Problem-solving approach) A light illuminating apparatus that irradiates light of a line shape includes a light source unit having a plurality of light sources arranged along a first direction on a surface of a substrate, a heat dissipation unit having a plurality of heat sink fins formed along the first direction, and thermally coupled to an opposing surface side of the substrate, a housing which receives the heat dissipation unit and forms a wind tunnel with a cooling wind flowing inside, wherein the cooling wind cools the heat sink fins, and a first cooling fan which generates the cooling wind flowing in the first direction within the wind tunnel, wherein at least one of opposite sides of a second direction of the housing has an air hole through which the cooling wind is discharged to outside via the plurality of heat sink fins, or the cooling wind is absorbed via the plurality of heat sink fins from outside, and the wind tunnel serves as a pressure chamber in which positive pressure or negative pressure is produced by the cooling wind.

A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

An electrical controller includes a housing, wherein the housing has cooling air openings on two different housing sides. A heat sink is arranged inside the housing, in particular so as to be protected against contact, and forms a cooling air channel, wherein the cooling air channel runs between the cooling air openings of the different housing sides. An electrically insulating holding element is designed to mechanically fix the heat sink inside the housing in a manner electrically insulated from the housing. A number of components to be cooled are provided, wherein the components are thermally conductively coupled to the heat sink and are held by the heat sink.

The light irradiation device includes a housing an air inlet through which cooling wind is introduced into the housing, an air outlet through which the cooling wind is discharged, a wind flow path through which the cooling wind taken in through the air inlet into the housing flows toward the air outlet, a light source part configured to be able to emit light toward the outside of the housing, and a heat sink provided at a position opposite to the first surface based on the light source part, in the wind flow path, wherein the wind flow path includes a first wind flow region and a second wind flow region located closer to the air outlet than the first wind flow region and having a smaller flow path cross sectional area than the first wind flow region.

Systems, methods, techniques and apparatuses of power switches are disclosed. One exemplary embodiment is a power switch comprising an outer housing; a power electronics board disposed within the housing and including a semiconductor switch structured to selectively conduct a current between a first power terminal and a second power terminal; a first heat sink coupled to the power electronics board; a plurality of thermally conductive connectors; a second heat sink coupled to the plurality of thermally conductive connectors, a control electronics board structured to control the semiconductor switch, the control electronics board being located within an enclosure formed of the second heat sink, the plurality of thermally conductive connectors, and the power electronics board.

A cooling system for cooling a set of components on a circuit board includes a vapor chamber for distributing heat over a larger surface area, a fan in a housing configured to direct a first airflow in a first direction to a first heatsink and direct a second airflow in a second direction opposite the first direction to a second heatsink. The heatsinks can have different sizes and the fan can be located relative to a midpoint of the vapor chamber or the circuit board or positioned relative to a component on the circuit board.