An electrical control panel including an enclosure box being sealed other than at an inlet opening and an outlet opening, a primary electrical component inside the enclosure box and having a first heat exchanger that transfers heat from the primary electrical component, one or more secondary electrical components inside the enclosure box that generate less heat than the primary electrical component, a second heat exchanger attached to the enclosure box and having an internal air passageway that includes an inlet opening and an outlet opening in fluid communication with the respective outlet and inlet openings of the enclosure box and defining therewith a sealed compartment, and one or more diverter elements direct a majority of the heated air from the first heat exchanger to enter the internal air passageway of the second heat exchanger without flowing over at least one of the secondary electrical components.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

A cooling unit can be downsized. Air is taken in through an intake port, and heat is discharged from a heat source through an exhaust port. A heat transport unit, forming a part of a cooling fan or is substantially in contact with it, has a first region which has one end facing the heat source and another end having a through hole which air taken in or air to be discharged passes through, and in which air passes through the through hole to perform heat exchange with the air in an inner wall of the through hole. The cooling fan has an intake opening and an exhaust opening. The through hole has an intake through hole and/or an exhaust through hole. Air passes through the intake port, the intake through hole, the intake opening, the exhaust opening, the exhaust through hole, and the exhaust port in this order.

The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.

Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

A portable information handling system housing has a handle to aid an end user in carrying of the system. A heat pipe loop passes through the handle and couples to a processing component heat sink to transfer excess thermal energy from within the housing to the handle for rejection to the ambient environment. Thermal wax disposed in the handle stores energy with a phase change from a solid to a liquid state. A color indicator disposed on the handle provides an end user with an indication of a temperature of the handle.

A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.