A device and method for assembling an electrical device that includes components attached to a carrier plate and is produced in accordance with an assembly method, wherein at least one component produces dissipated power which is dissipated via a thermal connection to a heat sink.

There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board 1 including a mounting region 2 and a terminal forming region 3, and a case housing the mounting region 2 of the circuit board 1. Electronic components 9 and 10 are mounted on the mounting region 2. A board terminal is formed in the terminal forming region 3. The case includes a case member 13 integrally formed with a wall surface and a male connector housing 13a. The wall surface forms a case internal space 21 that houses the mounting region 2. A female connector is mounted to the male connector housing 13a. The circuit board 1 penetrates the case member 13 such that the terminal forming region 3 is exposed to a housing space 22 side of the male connector housing 13a.

A device and method for assembling an electrical device that includes components attached to a carrier plate and is produced in accordance with an assembly method, wherein at least one component produces dissipated power which is dissipated via a thermal connection to a heat sink.

Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

The present invention refers to an electronic control (1) of a compressor (2), the electronic control (1) disposed in an encasement 5 (3), wherein the electronic control (1) comprises: a main board (4) associated to at least an auxiliary board (5,6,7), wherein one of the auxiliary boards (5,6,7) is a heat-generating board (7), wherein the heat-generating board (7) is disposed at a first distance (D.sub.1) in relation to a first wall of the encasement (P.sub.1), wherein the other auxiliary boards 0 (5,6) are disposed at least at a second distance (D.sub.2, D.sub.3) in relation to the first wall of the encasement (P.sub.1), wherein the first distance (D.sub.1) is less than the second distance (D.sub.2). A compressor (2) and a cooling equipment are also described.

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

The present application relates to the technical field of semiconductor, and in particular to an inverter. The inverter provided by the present application includes a substrate, a discrete device and a heat conducting component. The discrete device and the heat conducting component are both arranged on the substrate. A part of the heat conducting component is located in an area of the substrate where the discrete device is provided, and another part of the heat conducting component is located in an area of the substrate where the discrete device is not provided. The heat conducting component may rapidly transfer the heat of the overheated area of the substrate where the discrete device is mounted to the less hot area of the substrate, and promote the heat generated by the discrete device to spread evenly to the substrate.

An electronic device and an electronic device manufacturing method according to the present invention include, as a mode thereof, a substrate on which an element that produces heat, which is rectangular, is mounted, a radiator member disposed at a position facing the element that produces heat, and a heat conductive material filling a gap between the element that produces heat and the radiator member. The radiator member includes a rectangular frame that surrounds an arrangement region of the heat conductive material in a position of a surface facing the element that produces heat outside a peripheral edge of the element that produces heat, and has a cutout in at least one of four corners of the frame. With this configuration, when assembling the substrate onto the radiator member, excess heat conductive material flows out of the frame from the cutout.