Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.

A system may include a thermal source, a thermal sink, and heat-rejecting media comprising flexible graphite thermally coupled between the thermal source and the thermal sink and configured to transfer heat from the thermal source to the thermal sink.

A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.

A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.

Pierced thermal interface constructions including a thermal interface material (TIM) structure comprising: a TIM sheet comprising a plurality of piercings, where each of the plurality of piercings comprises a cavity and displaced material, and where the displaced material from each of the plurality of piercings protrudes away from the TIM sheet.

Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

A cooling device is provided having a heat source arranged on a support element, the support element arranged on a rigid heat barrier element and the heat barrier element arranged on a housing such that the support element, the heat barrier element and the housing form a mechanically rigid unit, the heat barrier element having a low heat conductivity, wherein a heat conducting element, arranged between the housing and the support element, bears against a first surface of the support element with a second surface and faces a fourth surface of the housing with a third surface, wherein the heat conducting element has a high heat conductivity, the second surface is at an angle to the third surface, and the heat conducting element is formed separately from the support element and the housing.

A thermal radiation heat dissipation device includes a radiation heat transfer pile including a plurality of polar dielectric material units of high energy gap, the polar dielectric material units each including at least one light scattering unit and a thermal radiation unit. The light scattering unit interacts with solar radiation to generate scattering of light. The thermal radiation unit interacts with thermal radiation to increase strength of thermal radiation.