This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

A heat transport device includes: a sub heat sink which extends along a surface of a main board on which a chip is mounted, and which has a sheet mounting hole formed in a portion including the chip as observed in plan view; a main heat sink which extends along a back surface opposite from the mounting surface and which is in thermal contact at a position on the back surface that corresponds to the chip; a sheet member which is installed to the sub heat sink in such a manner as to close the sheet mounting hole and which has thermal conductivity; and a bracket which is fixed to the main board and which covers the sheet mounting hole. The sheet member is in thermal contact with a surface of the chip and has lower rigidity than the sub heat sink.