Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case.

The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

A thermal dissipation composite material comprising: a matrix including a polymer material; and composite particles distributed in the matrix, wherein the composite particles include a filler, and a thermally conductive material coated on the surface of the filler by an inorganic coating layer, and wherein the plurality of thermally conductive materials coated by the inorganic coating layer are connected to each other on the surfaces of the plurality of composite particles so as to establish a heat transfer network.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.

Embodiments can provide a shutter assembly to improve heat transfer for an electronic component within an enclosure, the shutter assembly including: a shutter body comprising a distal end, a proximal end, a back surface and a flat facing surface extending from the distal end at an angle relative to the back surface, wherein the flat facing surface is configured to contact a surface of a connector body inserted within a base chassis within the enclosure to transfer heat from the connector body to the enclosure; and a spring mechanism coupled to the shutter body to apply rotational force on the shutter body to cause the flat facing surface of the shutter body to contact the surface of the connector body when the connector body is inserted in the enclosure to thereby conduct heat from the connector body to the enclosure.

An image capture assembly includes a heat-conducting housing, a camera component in the heat-conducting housing, and a heat-conducting sheet. The heat-conducting sheet is attached to the camera component and arranged between the camera component and the heat-conducting housing to dissipate heat generated by the camera component to the heat-conducting housing. The heat-conducting sheet extends to a side wall of the camera component from a bottom side of the camera component.

Disclosed are an electrical apparatus, a method for manufacturing an electrical apparatus, and a motor vehicle, the electrical apparatus (100) comprising: a chamber (110), the chamber (110) at least comprising a first electrical element (120) located at a first position and a second electrical element (130) located at a second position, the first electrical element (120) and the second electrical element (130) having different heat dissipation characteristics; wherein the electrical apparatus further comprises a potting spacer (140), the potting spacer (140) separating the chamber (110) into two sub-chambers: a first sub-chamber (111) and a second sub-chamber (112), and the first electrical element (120) is located in the first sub-chamber (111), the second electrical element (130) is located in the second sub-chamber (112).

An information handling system includes a printed circuit board (PCB), a barrier frame, thermal potting material that fills the barrier frame, and a heat removing structure embedded into the thermal potting material. The barrier frame encloses a first device, and extends to also enclose a second location of the PCB. The thermal potting material surrounds the first device. The heat removing structure includes a first pad co-located with the first device, a second pad co-located with the second location, and a thermally conductive connection between the first pad and the second pad. The heat removing structure may remove heat generated by the first device to the second pad.

The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.

A control device for a gearbox control system of a motor vehicle includes electric components having different high dissipated power, a rigid circuit board which is equipped on both sides with electric components, at least one cooling body on the same side as the circuit board on which the power components are arranged, and a potting compound, which at least partially surrounds the components. The circuit board is secured directly adjacent to the cooling body.