A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.

A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

An apparatus and heat management mechanism are described. The apparatus includes an outer casing enclosing at least one heat generating electronic structure, such as a plurality of electronic components included on at least printed circuit board, the outer casing having an inner surface and an outer surface. The apparatus and the heat management mechanism further include a heat dissipation structure thermally coupled to the heat generating structure or printed circuit board, the heat dissipation structure forming an open-ended columnar channel, the open-ended columnar channel allowing air to flow within the heat dissipation structure in a direction parallel to a surface of the heat generating structure or printed circuit board.

A shield structure includes: a shield frame electrically conductive and disposed around an electronic component mounted on a board top face of a circuit board, the shield frame having a lower end positioned toward, and secured to, the board top face to conduct electricity to the circuit board, and an upper end opened, and positioned across from the lower end; and an electrically conductive plate provided to the upper end of the shield frame, the electrically conductive plate including a thin area thinned across from the electronic component and the shield frame, and electrically connected to the shield frame through the thin area.

A thermal management system for transferring heat to and from a heat source. The system includes a thermal conductor thermally coupled to the heat source, a pressure dependent thermal conductance element thermally coupled to the conductor, and a heat sink thermally coupled to or thermally separable from the thermal conductance element. An actuator is configured relative to the thermal conductor, the thermal conductance element and the heat sink that controls the compression of the thermal conductance element between the thermal conductor and the heat sink so as to control the transfer of heat therebetween. The thermal conductance element can be compressible TIM element, such as a nanowire array, carbon nanotube forest, polymeric gasket, etc.

The present invention provides a heat conducting device with permeability, comprising a heat conducting base which is a metal heat conducting base, a graphite heat conducting base, or an alloy heat conducting base, and the heat conducting base is provided with a magnetic conducting seam which extends through two surfaces in thickness direction of the heat conducting base. The heat conducting device with permeability provided in the present invention uses graphite, metals, or alloys having shielding property and excellent heat conducting property as a heat conducting base, and by opening a magnetic conducting seam on the heat conducting base to relieve the shielding effect to the signals, the heat conducting device has both excellent heat conducting property and magnetic permeability, and can be applied to electronic products that have magnetic permeability requirements, thereby promoting the development of electronic products to be ultra-thin.

An electronic control unit includes a substrate, a plurality of electronic components, and a heat sink. The plurality of electronic components are mounted on the substrate, and include an integrated circuit and a plurality of tall components. The plurality of tall components are taller than the integrated circuit. The heat sink includes a recess collectively accommodating the plurality of tall components, and is provided on a side on which the plurality of tall components are mounted on the substrate.

Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

An electronic apparatus includes a first board, a second board, a housing, and a first thermal conductive assembly. The housing accommodates the first board and the second board. The first thermal conductive assembly connects a face of the first board, the face of the first board fronting a region between the first board and the second board, to a first face of the housing or a second face of the housing. The first face is opposed to the first board, the second face is opposed to the second board.

An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.