A heat dissipating sheet having an antenna function, and a portable terminal including the same are provided. The heat dissipating sheet, having an antenna function, according to one embodiment of the present disclosure comprises: an antenna part formed into an antenna pattern having a predetermined line width; and a heat dissipating part disposed on the same plane as the antenna part, and dissipating heat transferred from a heat source or distributing locally concentrated heat, wherein the antenna part and the heat dissipating part are directly attached to an inner surface of a rear case or a back cover of a portable terminal body through a medium of an adhesive member.

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

A component mounting part has a width shorter than a distance between guiderails. Backside projected parts protrude in a width direction from the component mounting part at a case-backside end. A width K2 which is a sum of a width of the component mounting part and widths of the backside projected parts is greater than a distance G1 between the guiderails. A clearance is formed between the circuit board and the heat conduction member when the backside projected parts are supported by the guiderails. A distance G3 from an insertion slot to an end of the guiderail on the case backside, is shorter than a distance K4 from an end of the circuit board on the side of the insertion slot to an end of the backside projected part on the side of the insertion slot.

A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

A joint structure includes a first member, a second member and a metal joint layer. The first member has including a first surface and is made of material having one of copper, copper alloy, aluminum, or aluminum alloy. The second member includes a second surface that faces the first surface of the first material. The metal joint layer includes a gold joint layer made of material having gold or gold alloy and is disposed between the first surface of the first material and the second surface of the second material. A thickness of the metal joint layer is smaller than flatness of the first surface of the first material and flatness of the second surface of the second material. Fluorine is dispersed inside at least the gold joint layer included in the metal joint layer.

Embodiments include semiconductor packages. A semiconductor package includes a lateral heat spreader (LHS) over a package substrate, and a first die over the LHS and package substrate. The first die has a first region and a second region, where the first and second regions are on a bottom surface of the first die. The semiconductor package includes a plurality of second dies over the first die, and an integrated heat spreader (IHS) over the second dies, first die, LHS, and package substrate. The IHS includes a lid and legs. The LHS thermally couples the first region of the first die to the legs of the IHS, and laterally extends from below the first region of the first die to below the legs of the IHS. The LHS may be comprised of graphene sheets, heat pipes, or vapor chambers and coupled to a thermal conductive material and a sealant.

A low inductance power module with low power loop inductance and high-power density is provided. The power module may include a vertical power loop structure, a cooling layer, and a thermal dissipation structure. The vertical power loop structure may utilize a substrate bottom conduction layer for electrical conduction. The thermal dissipation structure may be disposed between the substrate bottom conduction layer and the cooling layer. The vertical power loop structure may include integrated decoupling capacitors. Alternatively, the structure may include no integrated decoupling capacitors. The vertical power loop structure may include one or more half-bridge structures connected in parallel, each with its own integrated decoupling capacitors. The vertical power loop structure reduces power loop inductance in the power module, and the thermal dissipation structure provides electrical insulation, mechanical support, and thermal conduction.

A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.

Provided is a display device which has improved heat dissipation efficiency. A display device according to the present invention is provided with a display unit, a circuit board which is positioned in the rear of the display unit, a heat dissipation member which is positioned in the rear of the circuit board and is capable of dissipating the heat of the circuit board, and a case body which contains at least the heat dissipation member. The heat dissipation member has a plurality of heat dissipation pieces which protrude to the outside of the case body through an opening that is provided in the case body, and which extend in the vertical direction, and the opening has an inclined surface, which is inclined upwardly, in a portion that faces the top of each heat dissipation piece.

A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.