According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

An apparatus and heat management mechanism are described. The apparatus includes an outer casing enclosing at least one heat generating electronic structure, such as a plurality of electronic components included on at least printed circuit board, the outer casing having an inner surface and an outer surface. The apparatus and the heat management mechanism further include a heat dissipation structure thermally coupled to the heat generating structure or printed circuit board, the heat dissipation structure forming an open-ended columnar channel, the open-ended columnar channel allowing air to flow within the heat dissipation structure in a direction parallel to a surface of the heat generating structure or printed circuit board.

A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.

A heat dissipation structure includes a heat dissipation body and at least one cup-like structure. The heat dissipation body has a first surface and a second surface, wherein the first surface is adapted to couple with an electronic component. The cup-like structure is formed on the second surface of the heat dissipation body and includes a bottom and a curved structure. The curved structure connects the bottom and the second surface, and forms a closed contour at a junction with the second surface. A heat dissipation module includes the heat dissipation structure and a heat-conducting plate, wherein two sides of the heat-conducting plate adhere to the first surface and the electronic component, respectively.

A heat-dissipating substrate with a coating structure is provided. The heat-dissipating substrate includes at least two layers. A base layer is a heat dissipation layer, and one or more sputtered layers are formed on the heat dissipation layer. The sputtered layer has a corrosion resistant property, a soldering ability, or a sintering ability. A thickness of the sputtered layer is less than 5000 nm.

This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.

A heat conducting part is provided. The heat conducting part includes a shell, including an inner layer and an outer layer, where a cavity is enclosed by the inner layer, and the outer layer wraps a periphery of the inner layer; a capillary structure, disposed in the cavity and abutting against the shell; and cooling liquid, located in the cavity, where the inner layer and the outer layer are made of different materials, and a material density of the outer layer is lower than a material density of the inner layer. In the heat conducting part provided in this application, a material with a relatively large density and a stable chemical property may be selected for the inner layer to ensure durability of the heat conducting part.

This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.