Disclosed is a thermally conductive member capable of reliably performing a thermally conductive function with a simple structure. The thermally conductive member includes a container including an elastic body with a through hole passing through a top surface and a bottom surface thereof in a thickness direction and a thermally conductive support adhering to the bottom surface of the body and a thermally conductive element inserted or filled in an accommodation space formed by the through hole and the support and having self adhesion.

An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20 C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.