A pedestal housing for heat reduction generated by electronic components within the pedestal housing having a cover in which the electronic components are located, a cap positioned on an upper surface of the cover for forming an attic above the cover, a support layer and an insulation layer positioned between the cover and the cap in the attic and a heat and solar barrier layer positioned within the attic for electromagnetic radiation reflection away from the electronic components and electromagnetic radiation absorption from a radiation source and the electronic components.

Provided are a liner and a display device including the same. The liner includes a first liner including a first shield can protection portion, a first grip portion, and a connection portion coupling the first shield can protection portion to the first grip portion, a second liner including a second shield can protection portion and a second grip portion, and a perforated line formed along a boundary between the first liner and the second shield can protection portion.

A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.

Embodiments herein disclose techniques for electronic apparatuses including a printed circuit board (PCB) and an electromagnetic interference (EMI) shield for the PCB. An electronic apparatus may include a PCB with a plurality of layers including a ground layer. The PCB may include a cutout through the plurality of layers of the PCB. An EMI shield may be mounted to a bottom side of the PCB along an edge of the cutout, where the EMI shield may be coupled to the ground layer through an ohmic contact. The EMI shield may be flat. Other embodiments may also be described and claimed.

Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.

A system includes a shield for a low noise amplifier. The shield includes a top and one or more walls extending from the top defining a cavity. The shield further comprises at least one conducting member extending outwardly from the top and within the cavity. The shield may enclose an amplifier circuit and improve its signal-to-noise ratio.

A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.

An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

A composite comprising a polymeric matrix and EM absorbers dispersed within the polymeric matrix. Each EM absorber comprises a ceramic particle having a surface, and a magnetic coating on at least a portion of the surface of the ceramic particle. The EM absorbers function as dielectric and magnetic absorbers in the 1-100 GHz frequency range. The composite can be used as an electromagnetic shielding article to mitigate electromagnetic interference in, for example, high speed, high frequency (HSHF) consumer electronics.

A multilayer board level shield includes an electrically-conductive shielding layer disposed between inner and outer dielectric layers. The multilayer board level shield may have an overall thickness of about 25 microns or less. The multilayer board level shield may have sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components. One or more dielectric joints may be defined between the printed circuit board and the outer dielectric layer that attach the multilayer board level shield to the printed circuit board.