An electromagnetic wave shield structure includes: a substrate on which an electromagnetic wave emission source is mounted; a frame body provided over the substrate and including a conductor which surrounds an outer periphery of the electromagnetic wave emission source and receives a specific potential from the substrate; and a lid body, including a first insulator portion including a first surface facing the electromagnetic wave emission source and a second surface opposite to the first surface which are covered by a first conductive film electrically coupled with the frame body, configured to close an opening end of the frame body.

An electronic device housing including at least one first and one second housing part, wherein the housing wall of at least the first housing part is formed from a plastic which is electrically non-conductive, wherein on the inside of the housing wall of at least the first housing part a metallization is provided which has a lattice-like or honeycomb-like structure and is formed from a plurality of intersecting metallization regions running in the longitudinal direction and transverse direction, and wherein the metallization is applied by a laser direct structuring process.

A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.

A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.

According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.

An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.

Disclosed are apparatuses and techniques for fabricating apparatuses used as test platforms and commercial devices. In an aspect, an apparatus includes a non-conductive frame and a first shield structure. The first shield structure is part of the non-conductive frame. The first shield structure includes a first laser-activated surface structure, a first base metal disposed on the first laser-activated surface structure, and a first plating metal disposed on the first base metal.