Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.

An electromagnetic wave shielding sheet for a shield-can is disclosed, which is disposed between a metal bracket and a shield-can for shielding electromagnetic waves generated in a circuit element. It includes: a first conductive sheet part which includes a first conductive sheet having an electrical conductivity and conductive adhesive members disposed on both surfaces of the first conductive sheet; a pressure imparting member which is disposed on one surface of the first conductive sheet part and is compressible by an external force; and a second conductive sheet part which includes a second conductive sheet having an electrical conductivity and disposed on one surface of the first conductive sheet part to cover at least one surface of the pressure imparting member, and is electrically connected to the first conductive sheet part.

An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.

A wave absorbing heat dissipation structure adapted to absorb electromagnetic waves of an electronic component and dissipate heat energy of the electronic component. The wave absorbing heat dissipation structure includes a wave absorbing heat dissipation layer and a metal film. The wave absorbing heat dissipation layer is provided at an electronic device, and has a first surface and a second surface opposite to each other, wherein the first surface covers the electronic component. The metal film covers the second surface. The wave absorbing heat dissipation layer is adapted to absorb electromagnetic waves and transmit heat energy. The metal film is adapted to reflect electromagnetic waves and dissipate heat energy. The wave absorbing heat dissipation structure is capable of alleviating interference of electromagnetic waves on an electronic component and enhancing heat dissipation of an electronic component.

An electromagnetic wave shielding sheet for a shield-can is disclosed, which is disposed between a metal bracket and a shield-can for shielding electromagnetic waves generated in a circuit element. It includes: a first conductive sheet part which includes a first conductive sheet having an electrical conductivity and conductive adhesive members disposed on both surfaces of the first conductive sheet; a pressure imparting member which is disposed on one surface of the first conductive sheet part and is compressible by an external force; and a second conductive sheet part which includes a second conductive sheet having an electrical conductivity and disposed on one surface of the first conductive sheet part to cover at least one surface of the pressure imparting member, and is electrically connected to the first conductive sheet part.

An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.

A lightweight thermally dissipative EMI shield for electronics is composed of both metallic (e.g., conductive) and non-metallic (e.g., nonconductive) materials. The thermally dissipative EMI shield or cover may be formed of multiple layers of metallic or conductive materials and at least one layer of non-metallic or nonconductive material. There may be a conductive base layer, a lower intermediate nonconductive layer, an upper intermediate conductive layer, and an outer nonconductive layer. The conductive layers operate to thermally dissipate heat and suppress EMI, whereas the nonconductive layers provide lightweight rigidity and stiffness to support the EMI shield and protect components from foreign object ingress or damage of a circuit card or cover is coupled.

A method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board comprises providing a metallic lid with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board; filling the shielding chamber with an RF-absorber material; and removing RF-absorber material from the shielding chamber until the electronic component fits into the shielding chamber while a ceiling and lateral walls of the shielding chamber remain covered with RF-absorber material.

A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.