Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.

A shielding member includes a frame body and an outer cover. Two sides of a first end of the frame body respectively include a first shaft portion. Two sides of the frame body respectively include a first side plate. The frame body is covered by the outer cover. Two sides of a first end of the outer cover respectively include a second shaft portion, and each of the second shaft portions is pivotally connected to the corresponding first shaft portion. Two sides of the outer cover respectively include a second side plate, and each of the second side plates covers an outer side of the corresponding first side plate. Accordingly, the frame body and the outer cover are assembled to form a one-piece metallic shielding member. The structure of the shielding member is simple, the manufacturing for the shielding member is easy, and the cost for manufacturing the shielding member is reduced.

According to various embodiments of the disclosure, an electronic device may comprise a housing at least partially including an electrically conductive material, a first circuit board disposed in the housing, a connection member disposed on the first circuit board and partially extending past an edge of the first circuit board, a second circuit board disposed in the housing and connected to the connection member from a side of the first circuit board in which the connection member extends, and a shielding member disposed to surround the connection member and the second circuit board inside the housing. The shielding member may be electrically connected to at least one of the housing and the first circuit board. Other various embodiments are possible.

An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.

Provided are a thin electromagnetic shielding sheet and an electronic device having the same. The thin electromagnetic shielding sheet includes: a pressure-sensitive adhesive tape including a fiber-accumulating type substrate, formed by accumulation of a plurality of fibers and having a plurality of pores, and a metal coating layer on an outer circumferential surface of each of the plurality of fibers, and electrically conductive adhesive layers formed on both surfaces of the fiber-accumulating type substrate, and made of an electrically conductive adhesive material filled in the plurality of pores and electrically connected by an applied pressure; a metal layer which is adhered to the electrically conductive adhesive layer on one surface of the pressure-sensitive adhesive tape to shield electromagnetic waves; and an insulating layer formed on the metal layer.

Provided is a semiconductor device having excellent heat radiation performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening hole 21; a conductive cooling member 40 located above the conductive shield can 20; a heat conductive sheet 10 formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening hole 21; and a conductive member 11 electrically connecting the conductive shield can 20 and the conductive cooling member 40.

A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

An electronic device that is capable of keeping the impedance (ground impedance) between a printed circuit board and a shield case low. The electronic device includes a printed circuit board that has ground layer(s) which is conductive and is provided at a location in the thickness direction of the printed circuit board, and the shield case which is disposed on one side of the printed circuit board and consists of a hollow body that has conductivity. A through hole(s) passing through the ground layer is formed in the printed circuit board. A projecting portion(s), which is inserted into the through hole(s), is formed in a projecting manner in the shield case. In a state of being inserted in the through hole(s), the projecting portion(s) is electrically connected to the ground layer via solder.