Particular embodiments described herein provide for an electronic device that includes an electronic component, a support structure that includes a radiation source, a radiation shield on the support structure. The radiation shield includes a wall and the wall is not continuous around the radiation source and includes a radiation shield gap, where the electronic component covers the radiation shield gap to complete the radiation shield wall.

In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.

A frame includes a plurality of walls each having a first end and a second end facing away from each other along a first direction, and a plurality of spring fingers on the second end of one or more walls of the plurality of walls and extending along the first direction. First ends of the plurality of walls define an open bottom, and second ends of the plurality of walls define an open top.

Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

A modular system of plastic walls having embedded and coextensive electrically conductive components configured to electrically connect with each other when the walls are mated. The walls have joining edges that form joint seams with other walls when joined together to create an enclosure. When enough walls are used to surround a storage space, a Faraday cage is created. The walls additionally have portions of tortuous paths at each joining edge that mate with a complementary portion of a tortuous path of another wall when the walls are joined together. A torturous path seal is thereby created at each joint seam. The plastic walls can be configured in a multiplicity of combinations to create various enclosures necessary for RFID-enabled storage and tracking of medical articles. Containers, enclosures, cabinets, and drawers of differing heights and sizes can be made and they may be stacked or otherwise assembled.

An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component. The conductive shield can structure may include: a first conductive plate including a first edge portion, a second edge portion spaced apart from the first edge portion, and a third edge portion extending between the first and second edge portions, and in top view of the one face of the printed circuit board, including a first flat portion parallel to the printed circuit board and constructing a recess together with the first to third edge portions; a second conductive plate including a fourth edge portion extending substantially parallel to the third edge portion, and in top view of the one face of the printed circuit board, including a second flat portion to be attached to the first flat part while at least partially overlapping the first flat portion; a first side portion extending along the first edge portion and substantially vertical to the first flat portion; a second side portion extending along the second edge portion and substantially vertical to the first flat portion; and a third side portion bent from the fourth edge portion while surrounding the third edge portion, and substantially vertical to the first flat portion.

A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.

A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.