Methods for producing a printed circuit board and printed circuit boards are disclosed, including a method in which a slot is formed in a substrate, the substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. The conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

The present disclosure discloses a multilayer circuit board comprising a plurality of metal layers, a blind via and/or a buried via, the multilayer circuit board is capable of transmitting signal between the different metal layers. The blind via has a pad on a non-opening side of the blind via. An upper or lower layer metal layer on the non-opening side of the blind via adjacent to the blind via has a first hole which is located in a position corresponding to the pad on the non-opening side of the blind via in a depth direction of the blind via; and/or an upper and/or lower layer adjacent to the buried via has a second hole which is located in a position corresponding to the pad of an upper and/or lower orifice of the buried via in a depth direction of the buried via.

A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.

A multi-layered circuit board proofed against conductor loss or diminution when heated includes first and second circuit base boards. Each first circuit base board includes a first dielectric layer and a first wiring layer formed thereon and a first stepped paste block as a conductor formed in the first dielectric layer. The first stepped paste block is electrically connected to the first dielectric layer. Each second circuit base board includes a second dielectric layer and a second wiring layer, a second stepped paste block as a conductor is formed in the second dielectric layer. When pressed together for an electrical interconnection, the paste blocks are sealed and thus captive between the first and second circuit base boards.

A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.

A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.

The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

A method includes providing an electrically conductive layer structure on top of an electrically insulating layer structure, forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam, and subsequently removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than a size of the window.