A multi-layered circuit board proofed against conductor loss or diminution when heated includes first and second circuit base boards. Each first circuit base board includes a first dielectric layer and a first wiring layer formed thereon and a first stepped paste block as a conductor formed in the first dielectric layer. The first stepped paste block is electrically connected to the first dielectric layer. Each second circuit base board includes a second dielectric layer and a second wiring layer, a second stepped paste block as a conductor is formed in the second dielectric layer. When pressed together for an electrical interconnection, the paste blocks are sealed and thus captive between the first and second circuit base boards.

A PCB, a method of manufacturing the PCB, and a mobile terminal are provided. The PCB includes a PCB body and a PCB element. A first surface of the PCB body is provided with a groove. The PCB element includes a connection terminal, and a part of the PCB element is arranged within the groove. The connection terminal includes a first portion arranged within the groove and a second groove arranged outside the groove, and the first portion is electrically connected to conductive layers in the PCB body.

Provided is a display device including: a display panel in which a display area and a non-display area located around the display area are defined; an external device which is disposed on the non-display area of the display panel; and a cover member which is disposed on the external device, wherein the external device includes a driving chip and a printed circuit film which is disposed on the non-display area of the display panel and spaced apart from the display area with the driving chip interposed between the printed circuit film and the display area in plan view, and the cover member includes a first insulating tape disposed on the external device, a first conductive tape disposed on the first insulating tape and a second insulating tape disposed on the first conductive tape, wherein the second insulating tape includes an electrostatic induction opening penetrating the second insulating tape in a thickness direction, a planar size of the first conductive tape is greater than a planar size of the second insulating tape, the first conductive tape protrudes further toward the display area than the second insulating tape in plan view, and the electrostatic induction opening is disposed on a part of the first conductive tape which protrudes further toward the display area than the second insulating tape.

A multi-layered circuit board proofed against conductor loss or diminution when heated includes first and second circuit base boards. Each first circuit base board includes a first dielectric layer and a first wiring layer formed thereon and a first stepped paste block as a conductor formed in the first dielectric layer. The first stepped paste block is electrically connected to the first dielectric layer. Each second circuit base board includes a second dielectric layer and a second wiring layer, a second stepped paste block as a conductor is formed in the second dielectric layer. When pressed together for an electrical interconnection, the paste blocks are sealed and thus captive between the first and second circuit base boards.

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

A method includes providing an electrically conductive layer structure on top of an electrically insulating layer structure, forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam, and subsequently removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than a size of the window.

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

A circuit board structure includes a multi-layer board, a conductive body, and an electroplated layer. The multi-layer board has a predetermined conductive layer embedded therein, and includes a first blind hole recessed in a board surface thereof so as to allow a part of the predetermined conductive layer to be exposed therefrom. The first blind hole has an aperture having a diameter within a range of 0.15-0.5 mm, and has an aspect ratio defined as M that is within a range of 1.5-10. The conductive body is filled in the first blind hole and is electrically coupled to the part of the predetermined conductive layer. An inner surface of the conductive body defines a second blind hole having an aspect ratio that is larger than 0 and is less than M. The electroplated layer is formed in the second blind hole and is connected to the inner surface.