Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

In a laminated coil component, patterned conductor portions of a first coil portion and patterned conductor portions of a second coil portion are provided on respective insulation layers adjacent in a lamination direction, and include portions that overlap with each other when viewed in plan view. The insulation layers on which the patterned conductor portions of the second coil portion are provided are laminated between the plurality of insulation layers on which the patterned conductor portions of the first coil portion are provided. A first outer electrode to which the first coil portion is electrically connected and a second outer electrode to which the second coil portion is electrically connected are provided on the same main surface of a multilayer body.

A light emitting diode (LED) module with improved thermal characteristics is provided. The module includes an LED, a first circuit board, a second circuit board, a lower insulator, an upper insulator, a lower contact, upper contacts, and a heat sink. Preferably, the heat sink comprises an outer housing and a contact ring. The LED and the heat sink are attached to the first circuit board via solder. In addition to serving as a substrate for the LED, the first circuit board (which contains a plurality of thermally conductive layers connected by vias) facilitates the transfer of heat away from the LED to the heat sink. The module also has improved mechanical and electrical properties, including redundant electrical connections, stable mechanical connections, and a shock-absorbing lower contact. The lower insulator can also be configured to prevent misalignment of the power source with the lower contact when the module is used in a flashlight or other lighting device.

A single circuit board assembly for forming a vehicle-motor interface, the single circuit board assembly includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a plurality of layers, the plurality of layers having at least one through via and at least one buried via defined therein, wherein the at least one through via extends through all of the plurality of layers, the at least one buried via extending through less than all of the plurality of layers.

Disclosed is a memory module comprising a module printed circuit board including a chip region and a pad region and a memory chip provided on the module printed circuit board in the chip region. The module printed circuit board includes a board including a first surface and a second surface disposed opposite to each other, a first pad provided on the first surface in the pad region, and a second pad provided on the second surface in the pad region. The first pad is disposed farther from the chip region than the second pad.

A printed wiring board includes: a first layer including conductor layers; a second layer the first layer is stacked on; first vias formed in the first layer; first pads formed corresponding to the conductor layers in the first layer and connected to the first vias; ground patterns formed in the conductor layers and having openings surrounding the first pads; a second via formed in the second layer; and a second pad formed on a surface of the second layer on a side of the first layer and connected to the first and second vias, wherein the first pads and the second pad overlap in a plan view, wherein the diameters of the openings in the ground patterns are larger than that of the second pad, and wherein the diameter of the opening farthest from the second layer is smaller than that of the opening closest to the second layer.

A device includes a printed circuit board (PCB) including a signal trace electrically coupled to a signal via. The device further includes a slot ground configured to reduce signal interference with respect to the signal via. The slot ground includes a slot formed in the PCB at least partially surrounding the signal via. The slot ground further includes metal plating on a wall of the slot. The metal plating is electrically coupled to a ground plane of the PCB. The slot ground further includes resin at least partially filling the slot.

A printed circuit board (PCB), vertical conductive structures (VeCSs) for the PCB, and a method of fabricating a printed circuit board (PCB). The VeCS includes a VeCS slot at least partially defined in a dielectric substrate. A vertical signal trace is positioned on a first side of the VeCS slot and a vertical reference trace is positioned on a second side of the VeCS slot opposite the vertical signal trace. The VeCS has a predetermined impedance. A plurality of signal ground planes is positioned at a respective predetermined distance from the vertical signal trace. Each signal ground plane defines a cutout.

A PCB includes a unique fanout pattern that reduces cross-talk in a new way, and still enables the power routing into the connector of the PCB. Both signal integrity and power integrity performance meets the 224 Gbps requirement in terms of crosstalk, insertion loss, and return loss. In addition, the techniques disclosed herein improve on the density of the PCB and avoid the need for additional layer changing transition VIAs.

A printed circuit board includes a plurality of dielectric layers, a plurality of conductive pattern layers alternately laminated with the plurality of dielectric layers, a through hole penetrating through the plurality of the dielectric layers, a through via penetrating through the plurality of dielectric layers, and an inner layer via. The inner layer via penetrates through each dielectric layer from an Mth dielectric layer to the (N-1)th dielectric layer, where M is an integer that is greater than or equal to two and less than or equal to (N1), and has an inner circumferential surface on which an inner layer via conductor is disposed. The through via and the inner layer via are connected to each other with at least one conductive pattern layer that is selected from a second conductive pattern layer to an (N-1)th conductive pattern layer in the plurality of conductive pattern layers.