H05K2201/10787

Special electric component, printed circuit board assembly, and method of manufacturing an electric appliance
10264679 · 2019-04-16 · ·

A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.

Power semiconductor device

A power semiconductor device includes a plurality of power chips sealed in a package to control power and an IC sealed in the package to control each of the power chips. The IC is disposed at the center part of the package in the plan view. The plurality of power chips are disposed so as to surround the IC in the plan view.

Discrete device
10201087 · 2019-02-05 · ·

A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE
20180338376 · 2018-11-22 ·

The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.

CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME AND PANEL COMPONENT

The present invention discloses a connection component, connector, manufacturing method for the same and panel component. The connection component includes a first connector and a second connector electrically connected to the first connector, wherein, between the first connector and the second connector, a connection adhesive is provided, the first connector and/or the second connector both include a base body and multiple connection terminals, wherein the multiple connection terminals are disposed on the base body, a terminal portion of each connection terminal has a protrusion, the protrusion has a saw-tooth shape, and the saw-tooth shape has a regular pattern or a non-regular pattern, Accordingly, the present invention can enhance the reliability of the connection and increase the production yield.

DISCRETE DEVICE
20180288878 · 2018-10-04 · ·

A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

Devices and methods for solder flow control in three-dimensional microstructures
10076042 · 2018-09-11 · ·

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Electronic device

An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.

SEMICONDUCTOR DEVICE, METAL ELECTRODE MEMBER, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
20180190554 · 2018-07-05 · ·

On a conductive plate of an insulated substrate, one open end of a main body part of a cylindrical contact member is bonded by solder. In a hollow part of a hollow cylinder shaped external electrode terminal, a part of the other open end side of the main body part of the cylindrical contact member is inserted from an open end of the external electrode terminal. The other end of the external electrode terminal is separated into branches by cuts inserted in a through-hole insertion part. A column surface of the outside of the branches of the external electrode terminal has an arc shape. Pressure in a direction from inside the external electrode terminal toward the outside is applied to the branches of the through-hole insertion part by an auxiliary wedge. With such a configuration, assembly defects accompanying connection of the external electrode terminal and other members may be eliminated.

Wiring substrate and manufacturing method thereof

Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.