There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board.

A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

A press-fit terminal extends along a fitting direction and has a fitting portion, a base portion, and a cushioning structure. The fitting portion and the base portion are respectively located at two opposite ends of the press-fit terminal in the fitting direction. The cushioning structure has two connecting portions arranged at a spaced interval and connected between the fitting portion and the base portion. Each one of the two connecting portions has two connecting arms connected to each other and each extending linearly. The two connecting portions surround a polygonal hole formed through two opposite surfaces along the thickness-wise direction. With the simple shape design, the cushioning structure can be simply formed by shearing processes, which effectively reduces manufacturing complexity and cost and allows sizes and deformations of a product of the press-fit terminal to be more controllable.

A semiconductor module includes an insulated circuit board having an insulating member, a conductive plate arranged on the insulating member, and a semiconductor chip mounted on the conductive plate, and an insert-molded external connection terminal that includes a plurality of terminals, respectively connected to the insulated circuit board, and including a first terminal, and a pre-molded resin member that includes a pre-molded terminal fitting portion and a pre-molded pin insertion portion. The terminal fitting portion is made of a first resin material and has a first groove into which the first terminal is fitted. The pin insertion portion is made of the first resin material and has a hole configured to receive a pin arranged in a cavity of a metal mold used for insert-molding of the external connection terminal.