A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

An object is to, for physical properties, holding force, contact area, and insertion force in a trade-off relationship, set the holding force to 37 N or more, the contact area to 0.72 mm2 or more, and the insertion force to 90 N or less. A press-fit terminal is to be press-fitted into a through hole formed in a circuit board. A press-fit part includes a beam and an eye hole that is surrounded by the beam. The beam includes two parallel parts that are parallel to each other. In the press-fit part, G1/G2 is 0.20 or more and 1.05 or less where a front-side spring strength is G1 [mm3] and a rear-side spring strength is G2 [mm3] calculated under the following conditions, and G is 0.007 mm3 or more and 0.012 mm3 or less where a spring strength G [mm3] is G1+G2.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

A flexible printed circuit board (FPCB) assembly for a battery module includes a insulated flexible film and conductor patterns arranged inside the film in a predetermined form, and the conductor patterns transmit an electric signal. The FPCB assembly includes a main FPCB configured to extend in one direction; and a sub FPCB assembled to at least one side of the main FPCB and configured to extend in a direction different from the main FPCB.

A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.