A press-fit terminal includes a compliant part having a widened part including contact points that protrude to the outermost side along an orthogonal direction (first orthogonal direction Y) orthogonal to an insertion direction X with respect to a through hole of a board and a hole that allows deformation of the widened part toward an inside in the orthogonal direction, and is press-fitted into the through hole 23 along the insertion direction X to come into contact with an inner peripheral surface of the through hole of the board.

Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.

An electronic device includes a substrate having a top surface, a bottom surface and at least one opening therethrough. The substrate has circuity. A relay is mounted to the substrate and is electrically connected to the circuitry. The relay has a switching device configured to activate the relay. The switching device has contacts electrically connected to the circuitry. The relay is mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the top surface.

An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

A transformer is configured to include a pair of cores and that each have an inner leg, wherein a primary winding that is wound around a bobbin having a hollow into which the inner legs of the cores and are inserted, and a secondary winding that has a hollow into which the inner legs of the cores and are inserted and that is constituted of a conductor formed by die-cutting a metal plate into a ring, are dispersedly arranged over the inner legs of the cores and. The bobbin has bobbin support portions that come into contact with a surface of a printed circuit board on which the transformer is implemented.

A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.

An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.