An electrical conductor of a surface mount inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for surface mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and has an unbent distal end configured for surface mounting to the circuit board. The straight leads each have a height and a width which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.

The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

An electronic element assembly includes a first electronic element, an electronic element board and a flexible circuit. The first electronic element is disposed on the electronic element board, and the electronic element board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are disposed on relative sides of the first electronic element, respectively. The flexible circuit is disposed on the electronic element board, and the flexible circuit includes a connecting portion, a bending portion and an electronic path. The connecting portion is connected to the electronic element board. The bending portion is disposed on a side of the connecting portion away from the first electronic element. At least one portion of the electronic path is disposed on the bending portion.

A printed circuit board includes at least one conductor path and a contact area for contacting an electrical component. The contact area includes at least one contact surface and a recess. The contact surface extends into the recess and the contact surface is connected to the conductor path.

Example embodiments relate to electronic packages and electronic devices that include the same. One embodiment includes an electronic package. The electronic package includes a package body. The electronic package also includes a heat-conducting substrate arranged inside the package body and having a bottom surface that is exposed to an outside of the package body. Additionally, the electronic package includes an electronic circuit arranged inside the package body and including a semiconductor die that has a bottom surface with which it is mounted to the heat-conducting substrate and an opposing upper surface. Further, the electronic package includes one or more leads partially extending from outside the package body to inside the package body and over the minimum bounding box, each lead having a first end that is arranged inside the package body. In addition, the electronic package includes one or more bondwires for connecting the first end(s) to the electronic circuit.

An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.

A heat dissipation unit for a hard drive device is disclosed. The hard drive device has a housing and a plurality of internal heat-generating electronic components, a distance exists between at least one of the plurality of internal heating electronic components and the housing, the housing has an inner surface and an outer surface, and the heat dissipation unit is an intermediate extension member contacting at least one of the plurality of internal heat-generating electronic components, and extending beyond the inner surface.

An electronic device includes a substrate, conductive circuit lines, an anisotropic conductive block, and a plastic layer. The substrate has an arrangement surface having a mounting area and a coverage area, and the coverage area surrounds the mounting area. The conductive circuit lines are arranged in the coverage area. Each of the conductive circuit lines partially passes through the mounting area. The anisotropic conductive block includes an anisotropic conductive layer. The anisotropic conductive layer has a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive block covers the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the coverage area.

A wiring circuit board includes a metal layer, a base insulating layer, and a circuit pattern. The circuit pattern includes a terminal and a wire connected to the terminal. The wire has a connecting portion connected to the terminal. The width of the terminal is larger than the width of the connecting portion. In the thickness direction, a distance between at least a portion of the terminal and the metal layer is longer than a distance between at least a portion of the connecting portion and the metal layer.