A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a mounting block. The housing includes a base, a first side wall and a second side wall. Each terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot, and the second signal terminal has a second mounting foot. The housing includes a receiving groove at a bottom end of the base. The mounting block is received in the receiving groove. The mounting block is made of electroplated plastic. The mounting block has an opening for the first mounting foot and the second mounting foot to extend through. As a result, the backplane connector has a better shielding effect.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a mounting block. The housing includes a base, a first side wall and a second side wall. Each terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot, and the second signal terminal has a second mounting foot. The housing includes a receiving groove at a bottom end of the base. The mounting block is received in the receiving groove. The mounting block is made of electroplated plastic. The mounting block has an opening for the first mounting foot and the second mounting foot to extend through. As a result, the backplane connector has a better shielding effect.

A backplane connector includes a number of first conductive terminals, an insulating bracket, a first metal shield and a second metal shield. The first conductive terminal includes a first mating portion, a first tail portion and a first connection portion. The first conductive terminals include first differential signal terminals, a first ground terminal and a second ground terminal. The first mating portion, the first connection portion and the first tail portion extend along a mating direction so that the structural design of the conductive terminal is simplified. The first metal shield, the second metal shield, the first mating portion of the first grounding terminal and the first mating portion of the second grounding terminal are enclosed to form a shielding space. The first mating portions of the first differential signal terminals are located in the shielding space.

A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a metal shield surrounding member. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space for at least partially receiving a mating connector. The terminal module includes a first signal terminal, a second signal terminal and an insulating block fixed on the first signal terminal and the second signal terminal. The metal shield surrounding member at least partially surrounds the periphery of the first signal terminal and the second signal terminal. As a result, the shielding effect of the backplane connector is improved.

A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating bracket, a first metal shield, a second metal shield and a shielding space. The second backplane connector includes a second terminal module. Each second terminal module includes mating terminals mated with the first conductive terminals and a shielding shell surrounding a periphery of the mating terminals. The shielding shell is received in the shielding space. As a result, the backplane connector assembly of the present disclosure reduces crosstalk and improves the quality of signal transmission.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first elastic arm and a second elastic arm. The second metal shield has a third elastic arm and a fourth elastic arm. The first elastic arm and the third elastic arm are in contact with two opposite side surfaces of the contact portion of the first ground terminal. The second elastic arm and the fourth elastic arm are in contact with two opposite side surfaces of the contact portion of the second ground terminal. This arrangement increases the grounding shielding area, reduces crosstalk, and improves the quality of signal transmission.

A backplane connector includes a housing, a number of terminal modules, a metal shielding surrounding portion and a mounting block. The housing includes a base, a receiving groove and a number of insulating protrusions integrally extending from the base. The terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot. The second signal terminal has a second mounting foot. The metal shield surrounding member includes a first tail portion, a second tail portion and a hollow portion sleeved on the insulating protrusion. The mounting block is received in the receiving groove. As a result, the shielding effect of the backplane connector is improved.

A terminal module includes a number of conductive terminals and an insulating frame. Each conductive terminal includes a contact portion. The conductive terminals include a first signal terminal and a second signal terminal. The contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The terminal module includes an insulating block sleeved on the first contact arm and the second contact arm, and a metal shield surrounding member sleeved on the insulating block. The insulating block includes a limiting groove and the metal shield surrounding member includes a limiting protrusion protruding into the limiting groove. As a result, it facilitates to assemble the insulating block and the metal shield surrounding member. The present disclosure also relates to a backplane connector having the terminal module.

A backplane connector includes a number of wafers and a spacer for assembling the number of wafers together. Each wafer includes an insulating frame. The insulating frame includes a first protrusion. The spacer includes a body portion. The body portion has a number of slots for holding the first protrusions of the wafers. A periphery of each slot is surrounded by the body portion. Compared with the prior art, the spacer of the present disclosure is provided with a number of slots for holding the first protrusions of the wafers. As a result, the wafers can be easily assembled and fixed as a whole.