Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Assembly workability of an electric compressor to which an inverter circuit section and a filter circuit section are attached is improved. The inverter circuit section (3) includes an inverter control board (17), a sleeve assembly (18), and a power module (14). The inverter control board, the sleeve assembly, and the power module are integrated. The filter circuit section (4) includes a filter circuit board (66) and a support member (67). The filter circuit board (66) and the support member (67) are integrated. The inverter circuit section and the filter circuit section are structured to be capable of being stored each individually within an inverter storing section (8) from the same direction and detachably attached to the housing (2).

The present disclosure relates to an inverter module comprising: a power module coupled to a PCB; a thermal pad positioned between the PCB and the power module to prevent foreign substances from being attached to the PCB and the power module and to conduct heat; and a cooling device including a heat sink attached to the power module to cool the power module.

An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.

A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

An electric vehicle thermal management system for compressing a low pressure refrigerant with a centrifugal compressor to generate a high pressure refrigerant, determining a battery cooling condition, routing one of the low pressure refrigerant and the high pressure refrigerant to the heat exchanger in response to the battery cooling condition, regulating a transfer of heat between the refrigerant loop and the battery cooling loop in response to a temperature of the battery coolant within the battery cooling loop and the battery cooling condition, and regulating the transfer of heat between the battery coolant loop and a cabin coolant loop in response to the HVAC setting and a cabin coolant temperature within the cabin coolant loop.

An electronic device for a vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.