A circuit board assembly includes a circuit board, an electronic surface mount device (SMD), and a spacer that attaches the SMD to the circuit board. A coefficient of thermal expansion (CTE) of the spacer is closer to a CTE of the SMD than a CTE of the circuit board. The circuit board assembly also includes a flexible electrical lead that extends between and that is electrically connected to the SMD and the electrical node of the circuit board. Methods of manufacturing the circuit board assembly include selectively heating joining material at a predetermined heating rate and selectively cooling the joining material at a predetermined cooling rate to attach the flexible electrical leads to the SMD and the circuit board.

An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames connected to the pair of external electrodes, respectively. A coefficient of thermal expansion of the pair of metal frames has a value between a coefficient of thermal expansion of the capacitor body and a coefficient of thermal expansion of a solder.

An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

A circuit board assembly includes a circuit board, an electronic surface mount device (SMD), and a spacer that attaches the SMD to the circuit board. A coefficient of thermal expansion (CTE) of the spacer is closer to a CTE of the SMD than a CTE of the circuit board. The circuit board assembly also includes a flexible electrical lead that extends between and that is electrically connected to the SMD and the electrical node of the circuit board. Methods of manufacturing the circuit board assembly include selectively heating joining material at a predetermined heating rate and selectively cooling the joining material at a predetermined cooling rate to attach the flexible electrical leads to the SMD and the circuit board.

The present disclosure describes a non-welded leaf spring battery cell connector which allows for unrestricted outgassing during Lithium-Ion thermal runaway. The connector also has a low-resistance electrical connection surface for applications with rough, uneven contact surfaces such as those on refurbished Lithium-Ion battery cells. The connector is compatible with both protected and unprotected Lithium-Ion cells, as it allows for up to about 5 mm of vertical travel to support varying battery cell lengths caused by battery protection circuits. The leaf spring connector for Lithium-Ion battery cells is made of a conductive sheet of metal, cut and folded into a leaf-spring connector for a removable, non-welded battery cell. The leaf spring connector has one or more areas of material removed, as to not block the flow of caustic gasses during emergency outgassing.

Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and an opening disposed in the substrate. The opening extends between the first major surface and the second major surface. Tantalum material is disposed within the opening. Further, the tantalum material includes tantalum particles. The electrical component also includes an anode electrode disposed on the first major surface of the substrate and over the opening and a cathode electrode disposed on the second major surface of the substrate and over the opening.

Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material.

A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.

Disclosed is an electrode device for measuring an electric biosignal. The electrode device includes a flexible PCB (printed circuit board) having a flexible support layer and a trace layer on a first side. The trace layer includes at least two electrode pads for skin contacts and, for each electrode pad, a solder pad and a conducting trace forming a galvanic connection between the electrode and the solder pad. The flexible PCB further includes an opening defining a flexible, elongated cantilever in a central portion of the flexible PCB, having a base end connected to the central portion and a free end separated from the central portion. The solder pads are located at the free end. The electrode device further includes a connector component on the second side, soldered to the solder pads on the free end of the cantilever.

An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.